參數資料
型號: 101-1327
廠商: Rabbit Semiconductor
文件頁數: 85/119頁
文件大?。?/td> 0K
描述: KIT DEV STANDARD RCM6700
產品培訓模塊: Enabling Remote Devices Overview
標準包裝: 1
系列: MiniCore™
類型: MPU
適用于相關產品: RCM6700
所含物品: 3 板,線纜,CD,文檔
其它名稱: 316-1191
MiniCore RCM5700/RCM6700 User’s Manual
68
C.1 Introduction
The Prototyping Board included in the Development Kit provides a prototyping area for more
advanced hardware development. The Prototyping Board is shown below in Figure C-1, with its
main features identified.
Figure C-1. Prototyping Board
C.1.1 Prototyping Board Features
Power Connection
—Power is supplied to the Prototyping Board via the MiniCore header
socket connections.
Power LED
—The power LED lights whenever power is connected to the Prototyping Board.
Module Extension Headers
—The complete pin set of the MiniCore module is duplicated
below header J2. Developers can solder wires directly into the appropriate holes, or, for more
flexible development, a 2 × 25 header strip with a 0.1" pitch can be soldered into place. See
Figure C-4 for the header pinouts.
Prototyping Area
—A generous prototyping area is provided for the installation of through-
hole and surface-mount components. +3.3 V and ground buses run along the left and right
edges of the through-hole prototyping area. The through-hole area is set up to accept compo-
nents with a pitch of 0.1" or widths of 0.3" or 0.6". Several areas for surface-mount devices are
also available. (Note that there are SMT pads on both the top and the bottom of the Prototyping
Board.) Each SMT pad is connected to a hole designed to accept a 30 AWG solid wire.
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