- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄371374 > 22505 AMD Test Interface Port Board User＇s Manual? 2.62MB (PDF) PDF資料下載
參數(shù)資料
| 型號(hào)： | 22505 |
| 英文描述： | AMD Test Interface Port Board User＇s Manual? 2.62MB (PDF) |
| 中文描述： | AMD測(cè)試接口端口板用戶手冊(cè)？ 2.62MB（PDF格式） |
| 文件頁(yè)數(shù)： | 15/78頁(yè) |
| 文件大?。?/td> | 2691K |
| 代理商： | 22505 |
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)當(dāng)前第15頁(yè)第16頁(yè)第17頁(yè)第18頁(yè)第19頁(yè)第20頁(yè)第21頁(yè)第22頁(yè)第23頁(yè)第24頁(yè)第25頁(yè)第26頁(yè)第27頁(yè)第28頁(yè)第29頁(yè)第30頁(yè)第31頁(yè)第32頁(yè)第33頁(yè)第34頁(yè)第35頁(yè)第36頁(yè)第37頁(yè)第38頁(yè)第39頁(yè)第40頁(yè)第41頁(yè)第42頁(yè)第43頁(yè)第44頁(yè)第45頁(yè)第46頁(yè)第47頁(yè)第48頁(yè)第49頁(yè)第50頁(yè)第51頁(yè)第52頁(yè)第53頁(yè)第54頁(yè)第55頁(yè)第56頁(yè)第57頁(yè)第58頁(yè)第59頁(yè)第60頁(yè)第61頁(yè)第62頁(yè)第63頁(yè)第64頁(yè)第65頁(yè)第66頁(yè)第67頁(yè)第68頁(yè)第69頁(yè)第70頁(yè)第71頁(yè)第72頁(yè)第73頁(yè)第74頁(yè)第75頁(yè)第76頁(yè)第77頁(yè)第78頁(yè)
Test Interface Port Board User’s Manual
1-1
Chapter 1
Getting Started
The Test Interface Port (TIP) board comes prepared for immediate use. Connect
the supplied flexible ribbon cable to the TIP
board and to the host’s interface
connector, then follow the correct power-up procedure (see “Board Power” on
page 1-1), and the TIP board is ready to use. You can program the on-board Flash
memory with board diagnostics, a monitor program, or application software.
NOTE:
To use any application that may be programmed on the TIP board’s Flash
memory, set the Flash Select jumper to the INT position.
Board Power
The TIP board requires an external 5-V DC power supply with a 2.0-A current
rating. Although the external power supply provides the 5-V power for the board,
the board still does not power up (even with the external power supply connected)
unless a host board is also properly connected. This condition is caused by the two
power sources being routed through two MOSFETs that are managed by a
comparator. The comparator gets its power from the host VCC. This MOSFET/
comparator routing prevents any power to the board without the presence of both
the external and host power sources.
CAUTION: Do not provide power to the TIP board through a
host board without first connecting an external power source to
the TIP board. Failure to correctly follow this procedure causes
back powering of the FETs which could damage the TIP board.
Use the following procedure to power up the TIP board:
1. Be sure the host board is
not
powered up.
!
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| 22505_1 | AMD Test Interface Port Board Schematics? 149KB (PDF) |
| 225224541474 | Leaded ceramic multilayer capacitors |
| 225222521101 | Leaded ceramic multilayer capacitors |
| 225222521102 | Leaded ceramic multilayer capacitors |
| 225222521103 | Leaded ceramic multilayer capacitors |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| 22505_1 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:AMD Test Interface Port Board Schematics? 149KB (PDF) |
| 2250-5003UB | 制造商:3M Electronic Products Division 功能描述:CONNECTOR |
| 2250504-1 | 功能描述:CONN MAGJACK 1PORT 2.5G BASE-T 制造商:trp connector b.v. 系列:MagJack? 包裝:托盤(pán) 零件狀態(tài):在售 連接器類型:RJ45 端口數(shù):1 排數(shù):1 應(yīng)用:2.5G Base-T，AutoMDIX，以太網(wǎng)供電（PoE） 安裝類型:通孔 朝向:90°角（直角） 端接:焊接 板上高度:0.536"（13.61mm） LED 顏色:不包含 LED 每插孔芯數(shù):8 屏蔽:屏蔽式，EMI指 特性:板導(dǎo)軌 凸片方向:上 觸頭材料:磷青銅 觸頭鍍層:金 工作溫度:-40°C ~ 85°C 觸頭鍍層厚度:50μin（1.27μm） 屏蔽材料:不銹鋼 外殼材料:熱塑塑膠 標(biāo)準(zhǔn)包裝:90 |
| 225050411527 | 制造商:Yageo Corporation 功能描述:MLCC 1812 22PF 4KV NP0 5% |
| 225050411532 | 制造商:Yageo Corporation 功能描述:MLCC 1812 47PF 4KV NP0 5% |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。