參數(shù)資料
型號(hào): 24 - 27 GHz HPA
廠商: SIEMENS AG
英文描述: 24 - 27 GHz GaAs High Power Amplifier MMIC(24 - 27 GHz砷化鎵微波放大器)
中文描述: 24 - 27 GHz的砷化鎵MMIC的高功率放大器(24 - 27千兆赫砷化鎵微波放大器)
文件頁(yè)數(shù): 3/3頁(yè)
文件大小: 91K
代理商: 24 - 27 GHZ HPA
GaAs Components
24 - 27 GHz HPA
Data Sheet
3
2001-01-01
Recommendation of Bonding Conditions
Figure 1
Bond Plan
The gate and drain bias voltages can be applied from only one side of the chip, they are
connected internally. Capacitors to ground with approximately 100 pF should be used to
block the
V
G
and
V
D
bias pads.
Parameter
Thermocompression
Nailhead, without Ultrasonic
Wedge
Bonding
Bond Pull Test
Mil 883, > 2 g
Table Temp.
250
°
C
180
°
C
250
°
C
150
°
C
1 : 2.5 g
Tool Temp.
2 : 3.1 g
Scrub
100 Hz
3 : 3.2 g
Bond Force
50 g
25 g
4 : 3.0 g
Wire Diameter
25
μ
m
17
μ
m
5 : 2.8 g
EHT09206
RF IN
RF OUT
G1
V
V
D1
V
G2
V
D2
V
G1
V
D1
G2
V
D2
V
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