參數(shù)資料
型號: 24FC512
廠商: Microchip Technology Inc.
英文描述: 512K I2C CMOS Serial EEPROM
中文描述: 為512k的I2C的CMOS串行EEPROM
文件頁數(shù): 14/26頁
文件大小: 420K
代理商: 24FC512
24AA512/24LC512/24FC512
DS21754E-page 14
2004 Microchip Technology Inc.
9.0
PACKAGING INFORMATION
9.1
Package Marking Information
XXXXXXXX
T/XXXNNN
YYWW
8-Lead PDIP (300 mil)
Example:
8-Lead SOIC (208 mil)
Example:
24LC512
I/SM
0310017
24AA512
I/P017
0310
XXXXXXXX
T/XXXXXX
YYWWNNN
8-Lead DFN-S
Example
:
XXXXXXX
T/XXXXX
YYWW
NNN
24LC512
I/MF
0310
017
14-Lead TSSOP
Example
:
XXXXXXXT
YYWW
NNN
24LC512I
0310
017
Legend:
XX...X
T
Y
YY
WW
NNN
Customer specific information*
Temperature grade (I, E)
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Note
:In the event the full Microchip part number cannot be marked on one line, it will be
carried over to the next line thus limiting the number of available characters for customer
specific information.
*
Standard device marking consists of Microchip part number, year code, week code, and traceability code. For
device marking beyond this, certain price adders apply. Please check with your Microchip Sales Office.
相關(guān)PDF資料
PDF描述
24AA512 512K I2C CMOS Serial EEPROM
24LC512 512K I2C CMOS Serial EEPROM
24FC515 512K I2C CMOS Serial EEPROM
24AA515 512K I2C CMOS Serial EEPROM
24LC515 512K I2C CMOS Serial EEPROM
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
24FC512/S16K 制造商:Microchip Technology Inc 功能描述:512K, 64K X 8, 2.5V HI-SPEED S - Gel-pak, waffle pack, wafer, diced wafer on film
24FC512/W16K 制造商:Microchip Technology Inc 功能描述:512K, 64K X 8, 2.5V HI-SPEED S - Gel-pak, waffle pack, wafer, diced wafer on film
24FC512/WF16K 制造商:Microchip Technology Inc 功能描述:512K, 64K X 8, 2.5V HI-SPEED S - Gel-pak, waffle pack, wafer, diced wafer on film
24FC512E/CS17K 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:512K I2C Serial EEPROM
24FC512-E/CS17K 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:512K I2C? Serial EEPROM