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參數(shù)資料
| 型號(hào)： | 24LC256-IT/MS |
| 元件分類： | PROM |
| 英文描述： | 32K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8 |
| 封裝： | ROHS COMPLIANT, PLASTIC, MSOP-8 |
| 文件頁數(shù)： | 2/42頁 |
| 文件大?。?/td> | 797K |
| 代理商： | 24LC256-IT/MS |
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24AAXX/24LCXX/24FCXX
DS21930C-page 10
2007 Microchip Technology Inc.
4.0
FUNCTIONAL DESCRIPTION
Each 24XX device supports a bidirectional, 2-wire bus
and data transmission protocol. A device that sends
data onto the bus is defined as a transmitter, while a
device receiving data is defined as a receiver. The bus
has to be controlled by a master device which gener-
ates the Serial Clock (SCL), controls the bus access
and generates the Start and Stop conditions, while the
24XX works as slave. Both master and slave can
operate as transmitter or receiver, but the master
device determines which mode is activated.
Block Diagram
HV Generator
EEPROM
Array
Page Latches*
YDEC
XDEC
Sense Amp.
R/W Control
M
emory
C
ontrol
L
ogic
I/O
C
ontrol
L
ogic
I/O
A0*A1*A2*
SDA
SCL
VCC
VSS
WP*
* A0, A1, A2, WP and page latches are not used by some
devices.
See Table 1-1, Device Selection Table, for details.
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PDF描述 |
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| 24LCS21IP | I2C Serial EEPROM |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| 24LC256SC/S15K | 制造商:Microchip Technology Inc 功能描述:256K I2C SMARTCARD EE DIE IN WAFFLE PK - Gel-pak, waffle pack, wafer, diced wafer on film |
| 24LC256SC/W15K | 制造商:Microchip Technology Inc 功能描述:256K I2C SMARTCARD EE WAFER - Gel-pak, waffle pack, wafer, diced wafer on film |
| 24LC256SC/WF15K | 制造商:Microchip Technology Inc 功能描述:256K I2C SMARTCARD EE WFR ON FR - Gel-pak, waffle pack, wafer, diced wafer on film |
| 24LC256T-E/MF | 功能描述:電可擦除可編程只讀存儲(chǔ)器 256K 32K X 8 2.5V SER EE EXT RoHS:否 制造商:Atmel 存儲(chǔ)容量:2 Kbit 組織:256 B x 8 數(shù)據(jù)保留:100 yr 最大時(shí)鐘頻率:1000 KHz 最大工作電流:6 uA 工作電源電壓:1.7 V to 5.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 |
| 24LC256T-E/MNY | 功能描述:電可擦除可編程只讀存儲(chǔ)器 256K, 32Kx8, 2.5V SER EE, ExT RoHS:否 制造商:Atmel 存儲(chǔ)容量:2 Kbit 組織:256 B x 8 數(shù)據(jù)保留:100 yr 最大時(shí)鐘頻率:1000 KHz 最大工作電流:6 uA 工作電源電壓:1.7 V to 5.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 |
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