參數(shù)資料
型號(hào)： 25823
英文描述： Builder’s Guide for 2P Capable Servers and Workstations
中文描述： Builder的指南能夠二路服務(wù)器和工作站
文件頁(yè)數(shù)： 4/20頁(yè)
文件大?。?/td> 488K
代理商： 25823
25823A —February 2002
Builder’s Guide for 2P Capable Servers and Workstations
1
Hardware Considerations
The selection of the proper system hardware is critical to the success of the finished system.
For best results, a system builder should
always
contact the supplier or vendor for each of
the components to verify that each of the chosen component supports the desired system
configuration. The following data is a basic guideline that has been tested and approved by
the Engineering staff at AMD.
System Enclosures or Case Selection
The choice of the appropriate system enclosure depends on many factors as follows:
1. It must be compatible with the chosen motherboard and power supply.
2. It must be large enough to contain all the devices required.
3. It must be small enough to fit into its intended space.
4. It must be cost effective.
5. It must be reasonably easy to assemble (compared to other choices).
6. It must have good fit and finish, e.g., no razor-sharp edges.
7. It must allow enough airflow through the system to adequately cool all the internal
components, especially critical parts like the processor.
Basic Case Selection Guidelines
The first six factors are relatively self-evident
–
the seventh one can be elusive. Here are
some basic guidelines to aid in finding an enclosure with adequate cooling capability:
Standard horizontal cases are not recommended
–
use vertical cases only.
For a rack-mounted chassis, check with the chassis supplier as to its suitability.
Cases with an added fan in the back cool better than cases without an added fan.
Fans 80mm or larger work best.
Cables inside the enclosure can cause airflow disruptions. Cable-tie and route the cables
out of the path of the cooling airflow.
For vertical cases, power supplies with ATX-style bottom air intake vents maintain a
better thermal environment than power supplies with just a front air intake vent.
When the system is in a vertical case, there must be clear space in front of the case to
allow cooling air to flow in and space behind the case for the heated air to flow out.
The rear fans must all pull air in the same direction, otherwise one fan pulls warm air
out of the enclosure while the other fan pulls the preheated air back into the enclosure.
Front intake fans have not proven to be a significant benefit for vertical cases.
Figures 1 and 2 on page 2 show the airflow patterns in a vertical case with either a
front-inlet power supply or a bottom-inlet power supply. Testing by the AMD engineers has
found the bottom-inlet power supply to be desirable, the figures illustrate why this is.
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