參數(shù)資料
型號： 25823
英文描述： Builder’s Guide for 2P Capable Servers and Workstations
中文描述： Builder的指南能夠二路服務器和工作站
文件頁數(shù)： 5/20頁
文件大?。?/td> 488K
代理商： 25823
Builder’s Guide for 2P Capable Servers and Workstations
25823A —February 2002
2
Testing by the AMD thermal engineers
has shown that the airflow pattern seen
in Figure 1 is more desirable than the
airflow pattern seen in Figure 2. When
the bottom inlet power supply is used,
nearly all the air flows near or through
the area of the processors. As a result
of this, the processors remain cooler.
Since the heatsinks are heat radiators,
like the radiator in your automobile,
they need airflow to function properly.
The more airflow there is, the better
they function.
A power supply with a front air inlet
causes a portion of the airflow to be
diverted directly through the power
supply, never passing near the
heatsinks. With this type of power
supply, there is a greater potential for
overheating problems.
Therefore, the AMD thermal engineers
do not recommend using power
supplies with the front air inlet
configuration.
Figure 1. Desirable Airflow: Power Supply with Bottom Inlet
Figure 2. Undesirable Airflow: Power Supply with Front Inlet
The configuration in Figure 1 is the preferred configuration.
相關PDF資料
PDF描述
258605 SIGN-DANGER COMPRESSED AIR
258631 SIGN-DANGER HOT
258632 SIGN-DANGER HOT
258633 SIGN-DANGER HOT
258638 Evaluation Kit/Evaluation System for the MAX1254, MAX1253
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