參數資料
型號: 25AA128
廠商: Microchip Technology Inc.
英文描述: 128K SPI Bus Serial EEPROM
中文描述: 128K的SPI總線串行EEPROM
文件頁數: 16/26頁
文件大?。?/td> 432K
代理商: 25AA128
25AA128/25LC128
DS21831C-page 16
2007 Microchip Technology Inc.
8-Lead Plastic Dual In-Line (P) – 300 mil Body [PDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located with the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
INCHES
NOM
8
.100 BSC
.130
.310
.250
.365
.130
.010
.060
.018
Dimension Limits
MIN
MAX
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
N
e
A
A2
A1
E
E1
D
L
c
b1
b
eB
.210
.195
.325
.280
.400
.150
.015
.070
.022
.430
.115
.015
.290
.240
.348
.115
.008
.040
.014
N
E1
NOTE 1
D
1
2
3
A
A1
A2
L
b1
b
e
E
e
B
c
Microchip Technology Drawing C04-018B
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