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參數(shù)資料
| 型號(hào)： | 2815A |
| 廠商： | Electronic Theatre Controls, Inc. |
| 英文描述： | THERMALLY CONDUCTIVE DIE ATTACH ADHESIVE |
| 中文描述： | 導(dǎo)熱芯片粘接膠粘劑 |
| 文件頁(yè)數(shù)： | 1/3頁(yè) |
| 文件大?。?/td> | 287K |
| 代理商： | 2815A |
Typical properties are not intended for use as specification limits. If you need to write a specification, ask for our Standard Release Specification.
This is a developmental product that has been converted to high volume manufacturing and is being monitored for process stability. During this
monitoring period, certain properties may be adjusted slightly.
DEVELOPMENTAL TECHNICAL DATASHEET
ABLEBOND
2815A
THERMALLY CONDUCTIVE DIE ATTACH ADHESIVE
DESCRIPTION
ABLEBOND
2815A die attach adhesive offers high
thermal conductivity to minimize thermal resistance
between the chip and substrate. This adhesive is
09/03
Page 1 of 3
FEATURES
Excellent thermal and electrical conductivity
Good dispensability and good fillet formation
Good performance on Ag/Cu leadframes
Low moisture absorption
Typical Uncured Properties
ABLEBOND 2815A
Test Description
Test
Method
Filler Type
Silver
Viscosity @ 25oC
8000 cP
Brookfield CP51 @ 5 rpm
ATM-0018
Thixotropic Index
5.6
Viscosity @ 0.5/Viscosity @ 5 rpm
ATM-0089
Work Life @ 25oC
24 hours
25% increase in viscosity @ RT
ATM-0087
Est Storage Life @ -40oC
1 year
ATM-0068
Cure Process Data
ABLEBOND 2815A
Test Description
Test
Method
Weight Loss on Cure
6.8%
10 x 10 mm Si die on glass slide
ATM-0031
Recommended Cure Condition
30 min ramp RT to 200oC + 30 min @ 200oC in N
2
oven
PHYSIOCHEMICAL PROPERTIES
- Post Cure
Ionics
ABLEBOND 2815A
Test Description
Test
Method
Chloride
Sodium
Potassium
< 10 ppm
< 10 ppm
< 10 ppm
Teflon flask, 5 gm sample/20-40
mesh, 50 gm DI water, 100oC for
24 hours
ATM-0007
Water Extract Conductivity
70 μmhos/cm
Conductometer
ATM-0044
pH
3.5
pH meter
ATM-0002
Glass Transition Temperature
63oC
TMA penetration mode
ATM-0058
Coefficient of Thermal Expansion
Below Tg
Above Tg
64 ppm/oC
122 ppm/oC
TMA expansion mode
ATM-0055
designed to provide improved workability for applica-
tions requiring high heat extraction from die.
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