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參數(shù)資料
| 型號： | 2815A |
| 廠商： | Electronic Theatre Controls, Inc. |
| 英文描述： | THERMALLY CONDUCTIVE DIE ATTACH ADHESIVE |
| 中文描述： | 導(dǎo)熱芯片粘接膠粘劑 |
| 文件頁數(shù)： | 2/3頁 |
| 文件大小： | 287K |
| 代理商： | 2815A |
Page 2 of 3
2815A
PHYSIOCHEMICAL PROPERTIES
- Post Cure
Dynamic Tensile Modulus
ABLEBOND 2815A
Test Description
Test
Method
@-65oC
@ 25oC
@ 150oC
@ 250oC
9900 MPa (1,400,000 psi)
5700 MPa (830,000 psi)
1800 MPa (260,000 psi)
1600 MPa (230,000 psi)
Dynamic mechanical thermal
analysis (DMTA) using <0.5mm thick
sample
ATM-0112
Moisture Absorption @ Saturation
0.24%
Dynamic vapor sorption after 85oC/
85% RH exposure
ATM-0093
THERMAL/ELECTRICAL
PROPERTIES - Post Cure
ABLEBOND 2815A
Test Description
Test
Method
Thermal Conductivity
20 W/mK
Laser Flash
ATM-0116
Volume Resistivity
0.00004 ohm-cm
4-point probe
ATM-0020
Bond Joint Resistance
0.0002ohms
200 x 200 mil Cu/Cu,
6.4 μm bondline thickness
ATM-0032
MECHANICAL PROPERTIES -
Post Cure
ABLEBOND 2815A
Test Description
Test
Method
Die Shear Strength @ 25oC
5.8 kg
f
/die
2 x 2mm (80 x 80 mil) Si die on
Ag/Cu leadframe
ATM-0052
Die Shear Strength (kg
f
/die) vs.
Temperature
@25oC
12.3
@200oC
4.0
@250oC
3.4
3 x 3 mm (120 x 120 mil) Si
die on Ag/Cu leadframe
ATM-0052
Chip Warpage @ 25oC vs. Chip
Size
Chip Size
Warpage
9.7
μ
m
37.6
μ
m
0.38mm (15mil) thick
Si die on 0.2mm thick
Ag/Cu LF
7.6x7.6mm (300 x 300 mil)
12.7x12.7mm (500x500mil)
ATM-0059
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