參數(shù)資料
型號(hào): 44MPA0478
廠商: MIMIX BROADBAND INC
元件分類: 放大器
英文描述: 43.5-46.5 GHz GaAs MMIC Power Amplifier
中文描述: 43500 MHz - 46500 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER
封裝: DIE-14
文件頁(yè)數(shù): 3/5頁(yè)
文件大小: 434K
代理商: 44MPA0478
1
2
3
4
5
6
7
8
9
10
11
12
13
14
Vg1,2
RF
In
RF
Out
Vg3
Vd3
Vd1,2
2.490
(0.098)
1
2
3
4
5
6
7
8
9
10
11
12
13
0.937
(0.037)
1.438
(0.057)
1.937
(0.076)
2.337
(0.092)
3.538
(0.139)
2.936
(0.116)
2.337
(0.092)
1.937
(0.076)
1.438
(0.057)
0.937
(0.037)
0.0
1.549
(0.061)
14
2.936
(0.116)
3.538
(0.139)
0.933
(0.037)
4.330
(0.170)
Pre-production
Page 3 of 5
Mechanical Drawing
Bias Arrangement
Bypass Capacitors - See App Note [2]
(Note: Engineering designator is 44MPA0478)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All DC Bond Pads are 0.100 x 0.100 (0.004 x 0.004). All RF Bond Pads are 0.100 x 0.200 (0.004 x 0.008)
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 6.680 mg.
Bond Pad #1 (RF In)
Bond Pad #2 (Vg1A)
Bond Pad #3 (Vd1A)
Bond Pad #4 (Vg2A)
Bond Pad #5 (Vd2A)
Bond Pad #6 (Vg3A)
Bond Pad #7 (Vd3A)
Bond Pad #8 (RF Out)
Bond Pad #9 (Vd3B)
Bond Pad #10 (Vg3B)
Bond Pad #11 Vd2B)
Bond Pad #12 (Vg2B)
Bond Pad #13 (Vd1B)
Bond Pad #14 (Vg1B)
43.5-46.5 GHz GaAs MMIC
Power Amplifier
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Characteristic Data and Specifications are subject to change without notice.
2005 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
44MPA0478
Vg1,2
Vg3
RF
Out
Vd3
Vd1,2
RF
In
April 2005 - Rev 01-Apr-05
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