參數(shù)資料
型號(hào)： 4610M-902-103
英文描述： KONDENSATOR NETZWERK
中文描述： KONDENSATOR NETZWERK
文件頁(yè)數(shù)： 51/62頁(yè)
文件大?。?/td> 1883K
代理商： 4610M-902-103
Specifications are subject to change without notice.
331
Use Bourns Networks To:
Match impedance between memory driver and the DRAM
array.
Minimize reflections and ringing in DRAM inputs.
Prevent undershoot of RAS, CAS, and WE signals which
may result in latch-up of DRAM inputs
Improve system performance by allowing faster setting
times for DRAM inputs.
Need For Damping
The address lines (RAS, CAS) and control lines (WE) of
dynamic RAM arrays are driven in parallel, causing significant
loading on the driver of the DRAM arrays. Each DRAM control
input (WE) has capacitive loading between 5pF to 7pF, while
each address line input has about a 10pF load.
Thus each DRAM input can be modeled as a transmission line
with distributed inductance and capacitance. If not properly ter-
minated, signal reflections and ringing on the line will result,
adversely affecting the performance of the memory system. The
effects on signal transitions will be:
1. Increased settling time delay on low-to-high transitions.
2. Voltage undershoot on high-to-low transitions.
Increased settling time due to ringing reduces system perfor-
mance because the design has to allow for the settling delay
before sampling the signal. Undershoot, by bringing the input
voltage below 0 volts, can damage the driver IC as well as alter
the DRAM’s internal address register contents, causing potential
loss of data.
TIMING
REFERENCE
MEMORY
CONTROL
DATA
SYSTEM DATA BUS
TIMING
CONTROLLERS
DATA
CPU
ADDRESS
DYNAMIC
MEMORY
CONTROL
ADDRESS
RAS
CAS
WE
DYNAMIC
MEMORY
ARRAY
BLOCK DIAGRAM OF DRAM SYSTEM
EFFECT OF DAMPING RESISTOR
WITHOUT
DAMPING
RESISTOR
WITH
DAMPING
RESISTOR
Courtesy of B. Narasimhan and J. Shaffer, Micron Techology Corporation.
t1
t2
1
V
"HIGH"
LOGIC
LEVEL
COMPARISON OF UNDERSHOOTS
WITHOUT
DAMPING RESISTOR
WITH
DAMPING RESISTOR
t1 - TIME TO ACCEPTABLE "LOW" LOGIC LEVEL FOR
DRIVER WITHOUT DAMPING RESISTOR
t2 - TIME TO ACCEPTABLE "LOW" LOGIC
LEVEL WITHDAMPING RESISTOR
DRAM Applications
相關(guān)PDF資料
PDF描述
4610M-902-104 Dual/Triple Ultra-Low-Voltage SOT23 µP Supervisory Circuits
4610X-101-101 WIDERSTAND NETZWERK DICKFILM 100R 5ST
4610X-101-102 Dual/Triple Ultra-Low-Voltage SOT23 µP Supervisory Circuits
4610X-101-103 WIDERSTAND NETZWERK DICKFILM 10K 5ST
4610X-101-104 Dual/Triple Ultra-Low-Voltage SOT23 µP Supervisory Circuits
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
4610M-902-103LF 功能描述:電容器陣列與網(wǎng)絡(luò) 10Pin 0.01uF 20% Isolated X7R RoHS:否 制造商:AVX 電容:0.1 uF 容差:20 % 電壓額定值:6.3 V 元件數(shù)量:2 工作溫度范圍: 外殼長(zhǎng)度:0.8 mm 外殼寬度:1.6 mm 外殼高度:0.5 mm 端接類(lèi)型:SMD/SMT 系列:PG
4610M-902-104 功能描述:電容器陣列與網(wǎng)絡(luò) 10Pin 0.1uF 20% Isolated X7R RoHS:否 制造商:AVX 電容:0.1 uF 容差:20 % 電壓額定值:6.3 V 元件數(shù)量:2 工作溫度范圍: 外殼長(zhǎng)度:0.8 mm 外殼寬度:1.6 mm 外殼高度:0.5 mm 端接類(lèi)型:SMD/SMT 系列:PG
4610M-902104LF 制造商:Bourns / JW Miller 功能描述:Cap Ceramic Network 0.1uF 50V X7R 20% SIP 5 Capacitor 125°C 制造商:Bourns 功能描述:Cap Ceramic Network 0.1uF 50V X7R 20% SIP 5 Capacitor 125°C
4610M-902-104LF 功能描述:電容器陣列與網(wǎng)絡(luò) 10Pin 0.1uF 20% Isolated X7R RoHS:否 制造商:AVX 電容:0.1 uF 容差:20 % 電壓額定值:6.3 V 元件數(shù)量:2 工作溫度范圍: 外殼長(zhǎng)度:0.8 mm 外殼寬度:1.6 mm 外殼高度:0.5 mm 端接類(lèi)型:SMD/SMT 系列:PG
4610M-AP1-472LF 制造商:Bourns Inc 功能描述:
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