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參數(shù)資料
| 型號： | 5962-554901NXDR |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | 比較器 |
| 英文描述： | DUAL COMPARATOR, 10000 uV OFFSET-MAX, 650 ns RESPONSE TIME, PDSO8 |
| 封裝： | SO-8 |
| 文件頁數(shù)： | 9/15頁 |
| 文件大?。?/td> | 238K |
| 代理商： | 5962-554901NXDR |
TLC372, TLC372Q, TLC372Y
LinCMOS
DUAL DIFFERENTIAL COMPARATORS
SLCS114B – NOVEMBER 1983 – REVISED MARCH 1999
3
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
TLC372Y chip information
These chips, when properly assembled, display characteristics similar to the TLC372C. Thermal compression
or ultrasonic bonding can be used on the doped-aluminum bonding pads. Chips can be mounted with
conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 3.6
× 3.6 MINIMUM
TJmax = 150°C
TOLERANCES ARE
±10%.
ALL DIMENSIONS ARE IN MILS.
PIN (4) INTERNALLY CONNECTED
TO BACKSIDE OF CHIP.
+
–
1OUT
1IN +
1IN –
VCC +
(8)
(6)
(3)
(2)
(5)
(1)
–
+
(7)
2IN +
2IN –
2OUT
(4)
GND
57
(3)
(2)
(7)
(8)
(1)
(5)
(6)
(4)
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