參數(shù)資料
型號(hào): 5962-9088202MPA
廠商: TEXAS INSTRUMENTS INC
元件分類: 運(yùn)算放大器
英文描述: DUAL OP-AMP, 1250 uV OFFSET-MAX, 1.9 MHz BAND WIDTH, CDIP8
封裝: CERAMIC, DIP-8
文件頁(yè)數(shù): 56/67頁(yè)
文件大?。?/td> 1352K
代理商: 5962-9088202MPA
TLC220x, TLC220xA, TLC220xB, TLC220xY
Advanced LinCMOS LOW NOISE PRECISION
OPERATIONAL AMPLIFIERS
SLOS175B FEBRUARY 1997 REVISED JANUARY 2008
6
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
TLC2202Y chip formation
This chip, when properly assembled, displays characteristics similar to the TLC2202C. Thermal compression
or ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with
conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
CHIP THICKNESS: 15 MILS TYPICAL
BONDING PADS: 4
× 4 MILS MINIMUM
TJmax = 150°C
TOLERANCES ARE
±10%.
ALL DIMENSIONS ARE IN MILS.
PIN (4) IS INTERNALLY CONNECTED
TO BACKSIDE OF CHIP.
+
1OUT
1IN +
1IN
VDD+
(8)
(6)
(3)
(2)
(5)
(1)
+
(7)
2IN +
2IN
2OUT
(4)
VDD
100
80
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
相關(guān)PDF資料
PDF描述
5962-9088204Q2A DUAL OP-AMP, 750 uV OFFSET-MAX, 1.9 MHz BAND WIDTH, CQCC20
5962-9088204QPA DUAL OP-AMP, 750 uV OFFSET-MAX, 1.9 MHz BAND WIDTH, CDIP8
5962-9088201M2A OP-AMP, 700 uV OFFSET-MAX, 1.9 MHz BAND WIDTH, CQCC20
5962-9088201MPA OP-AMP, 700 uV OFFSET-MAX, 1.9 MHz BAND WIDTH, CDIP8
5962-9088203Q2A OP-AMP, 400 uV OFFSET-MAX, 1.9 MHz BAND WIDTH, CQCC20
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