參數(shù)資料
型號: 5962-9089502MCA
廠商: TEXAS INSTRUMENTS INC
元件分類: 運算放大器
英文描述: OP-AMP, 50 uV OFFSET-MAX, 1.9 MHz BAND WIDTH, CDIP14
封裝: CERAMIC, DIP-14
文件頁數(shù): 16/36頁
文件大小: 916K
代理商: 5962-9089502MCA
TLC2654, TLC2654A
Advanced LinCMOS
LOW-NOISE CHOPPER-STABILIZED
OPERATIONAL AMPLIFIERS
SLOS020G – NOVEMBER 1988 – REVISED APRIL 2001
23
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
APPLICATION INFORMATION
theory of operation (continued)
The TLC2654 removes this restriction on ac performance by using a 10-kHz internal clock frequency. This high
chopping frequency allows amplification of input signals up to 5 kHz without errors due to intermodulation and
greatly reduces low-frequency noise.
THERMAL INFORMATION
temperature coefficient of input offset voltage
Figure 36 shows the effects of package-included thermal EMF. The TLC2654 can null only the offset voltage
within its nulling loop. There are metal-to-metal junctions outside the nulling loop (bonding wires, solder joints,
etc.) that produce EMF. In Figure 36, a TLC2654 packaged in a 14-pin plastic package (N package) was placed
in an oven at 25
°C at t = 0, biased up, and allowed to stabilize. At t = 3 min, the oven was turned on and allowed
to rise in temperature to 125
°C. As evidenced by the curve, the overall change in input offset voltage with
temperature is less than the specified maximum limit of 0.05
V/°C.
Input
Offset
V
oltage
– 12
– 15
4
– 18
0
3
6
9
12
15
18
– 4
– 8
0
t – Time – min
8
21
24
27
30
0.1
F
0.1
F
50 k
5 V
– 5 V
50 k
100
VO
VIO = VO /1000
0
– 0.04
0.04
+
V
IO
V
aVIO
T
emperature
Coefficient
of
Input
Offset
V
oltage
uV/C
α
VIO
V/
C°
IN –
IN +
4
5
OUT
10
– 0.08
– 0.12
– 0.16
– 0.2
0.08
Pin numbers shown are for the D (14-pin), J, and N
packages.
Figure 36. Effects of Package-Induced Thermal EMF
相關PDF資料
PDF描述
5962-9089502MPA OP-AMP, 50 uV OFFSET-MAX, 1.9 MHz BAND WIDTH, CDIP8
5962-9089504QCA OP-AMP, 40 uV OFFSET-MAX, 1.9 MHz BAND WIDTH, CDIP14
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