參數(shù)資料
型號: 5962-9169002M3X
廠商: ANALOG DEVICES INC
元件分類: ADC
英文描述: 1-CH 12-BIT SUCCESSIVE APPROXIMATION ADC, PARALLEL ACCESS, CQCC28
封裝: CERAMIC, CC-28
文件頁數(shù): 10/22頁
文件大?。?/td> 294K
代理商: 5962-9169002M3X
STANDARDIZED
MICROCIRCUIT DRAWING
DEFENSE ELECTRONICS SUPPLY CENTER
DAYTON, OHIO 45444
SIZE
A
5962-91690
REVISION LEVEL
B
SHEET
16
DESC FORM 193A
JUL 94
3.8 Notification of change for device class M. For device class M, DESC, DESC's agent, and the change of product (see 6.2
herein) involving devices acquired to this drawing is required for any change as defined in MIL-STD-973.
3.9 Verification and review for device class M. For device class M, DESC, DESC's agent and the acquiring activity retain the
option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made
available onshore at the option of the reviewer.
3.10 Microcircuit group assignment for device classes M. Device classes M devices covered by this drawing shall be in
microcuiruit group number 93 (see MIL-M-38535, appendix A).
4. QUALITY ASSURANCE PROVISIONS
4.1 Sampling and inspection. For device class M, sampling and inspection procedures shall be in accordance with MIL-STD-
883 (see 3.1 herein). For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-I-38535
and the device manufacturer's QM plan.
4.2 Screening. For device class M, screening shall be in accordance with method 5004 of MIL-STD-883, and shall be
conducted on all devices prior to quality conformance inspection. For device classes Q and V, screening shall be in accordance
with MIL-I-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection.
4.2.1 Additional criteria for device classes M.
a. Burn-in test, method 1015 of MIL-STD-883.
(1)
Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document
revision level control and shall be made available to the preparing or acquiring activity upon request. The
test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance
with the intent specified in test method 1015.
(2)
T = +125
C, minimum.
A
b. Interim and final electrical test parameters shall be as specified in table II herein.
4.2.2 Additional criteria for device classes Q and V.
a.
The burn-in test duration, test condition and test temperature or approved alternatives
shall be as
specified in the device manufacturer's QM plan in accordance with MIL-M-38535.
The burn-in test shall
be submitted to DESC-ECS with the certificate of compliance and shall be under the control of the device
manufacturer's Technology Review Board (TRB) in accordance with MIL-I-38535.
b.
Interim and final electrical test parameters shall be as specified in table IIA herein.
c.
Additional screening for device class V beyond the requirements of device class Q shall be as specified in
appendix B of MIL-I-38535.
4.3 Qualification inspection.
4.3.1 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be in
accordance with MIL-I-38535. Inspections to be performed shall be those specified in MIL-I-38535 and herein for groups A, B,
C, D, and E inspections (see 4.4.1 through 4.4.4).
4.4 Conformance inspection. Quality conformance inspection for device class M shall be in accordance with
MIL-STD-883 (see 3.1 herein) and as specified herein. Inspections to be performed for device class M shall be those specified
in method 5005 of MIL-STD-883 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4). Technology
conformance inspection for classes Q and V shall be in acccordance with MIL-I-38535 including groups A, B, C, D, and E
inspections and as specified herein except where option 2 of MIL-I-38535 permits alternate in-line control testing.
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