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參數(shù)資料
| 型號： | 5962F9671201VXC |
| 廠商： | INTERSIL CORP |
| 元件分類： | 門電路 |
| 英文描述： | Radiation Hardened Hex Inverter |
| 中文描述： | ACT SERIES, HEX 1-INPUT INVERT GATE, CDFP14 |
| 封裝： | CERAMIC, DFP-14 |
| 文件頁數(shù)： | 14/23頁 |
| 文件大?。?/td> | 187K |
| 代理商： | 5962F9671201VXC |
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-96712
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
D
SHEET
21
DSCC FORM 2234
APR 97
APPENDIX A
APPENDIX A FORMS A PART OF SMD 5962-96712
Die bonding pad locations and electrical functions.
Die physical dimensions.
Die size:
2240 x 2240 microns
Die thickness:
21
±2 mils
Note: Pad numbers reflect terminal numbers when placed in case outlines C and X (see figure 1).
FIGURE A-1. Die bonding pad locations and electrical functions.
Optional manufacturer’s
logo
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| 5962F9671802VXC | 制造商:INTRSL 功能描述: |
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| 5962F9861301VHA | 制造商:Intersil Corporation 功能描述:- Bulk |
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