參數(shù)資料
型號(hào)： 70V3319S166BFG
廠商： INTEGRATED DEVICE TECHNOLOGY INC
元件分類(lèi)： SRAM
英文描述： 256K X 18 DUAL-PORT SRAM, 3.6 ns, CBGA208
封裝： 15 X 15 MM X 1.4 MM, 0.80 MM PITCH, GREEN, FPBGA-208
文件頁(yè)數(shù)： 1/23頁(yè)
文件大?。?/td> 222K
代理商： 70V3319S166BFG
2009 Integrated Device Technology, Inc.
JANUARY 2009
DSC 5623/9
1
Functional Block Diagram
Features:
◆
True Dual-Port memory cells which allow simultaneous
access of the same memory location
◆
High-speed data access
– Commercial: 3.6ns (166MHz)/4.2ns (133MHz) (max.)
– Industrial: 4.2ns (133MHz) (max.)
◆
Selectable Pipelined or Flow-Through output mode
– Due to limited pin count PL/
FT option is not supported
on the 128-pin TQFP package. Device is pipelined
outputs only on each port.
◆
Counter enable and repeat features
◆
Dual chip enables allow for depth expansion without
additional logic
◆
Full synchronous operation on both ports
– 6ns cycle time, 166MHz operation (6Gbps bandwidth)
– Fast 3.6ns clock to data out
– 1.7ns setup to clock and 0.5ns hold on all control, data, and
address inputs @ 166MHz
– Data input, address, byte enable and control registers
– Self-timed write allows fast cycle time
◆
Separate byte controls for multiplexed bus and bus
matching compatibility
◆
Dual Cycle Deselect (DCD) for Pipelined Output mode
◆
LVTTL- compatible, single 3.3V (±150mV) power supply
for core
◆
LVTTL compatible, selectable 3.3V (±150mV) or 2.5V
(±100mV) power supply for I/Os and control signals on
each port
◆
Industrial temperature range (-40°C to +85°C) is
available at 133MHz.
◆
Available in a 128-pin Thin Quad Flatpack, 208-pin fine
pitch Ball Grid Array, and 256-pin Ball
Grid Array
◆
Supports JTAG features compliant to IEEE 1149.1
– Due to limited pin count, JTAG is not supported on the
128-pin TQFP package
◆
Green parts available, see ordering information
HIGH-SPEED 3.3V
256/128K x 18
SYNCHRONOUS
DUAL-PORT STATIC RAM
WITH 3.3V OR 2.5V INTERFACE
IDT70V3319/99S
Dout0-8_L
B
W
0
L
B
W
1
L
Din_L
OEL
UBL
LBL
R/
WL
CE0L
CE1L
ab
FT/PIPEL
0/1
1b 0b 1a 0a
1
0
1/0
0b 1b
0a 1a
ab
FT/PIPEL
1/0
REPEATR
A17R(1)
A0R
CNTENR
ADSR
Dout0-8_R
Dout9-17_R
I/O0R -I/O17R
Din_R
ADDR_R
OER
UBR
LBR
R/
WR
CE0R
CE1R
FT/PIPER
CLKR
,
Counter/
Address
Reg.
B
W
1
R
B
W
0
R
FT/PIPER
Counter/
Address
Reg.
CNTENL
ADSL
REPEATL
Dout9-17_L
I/O0L -I/O17L
A17L(1)
A0L
ADDR_L
5623 tbl 01
256K x 18
MEMORY
ARRAY
CLKL
,
JTAG
TCK
TRST
TMS
TDO
TDI
ba
0/1
0b 1b
0a 1a
1
0
1/0
1b 0b
1a 0a
a
b
1/0
NOTE:
1. A17 is a NC for IDT70V3399.
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
70V3319S166BFG8 制造商:Integrated Device Technology Inc 功能描述:SRAM Chip Sync Dual 3.3V 4.5M-Bit 256K x 18 12ns/3.6ns 208-Pin CABGA T/R 制造商:Integrated Device Technology Inc 功能描述:SRAM SYNC DUAL 3.3V 4MBIT 256KX18 12NS/3.6NS 208FPBGA - Tape and Reel 制造商:Integrated Device Technology Inc 功能描述:256Kx18 STD-PWR 3.3V SYNC DUAL-PORT RAM
70V3319S166PRF 功能描述:靜態(tài)隨機(jī)存取存儲(chǔ)器 256Kx18 STD-PWR 3.3V SYNC DUAL-PORT RAM RoHS:否 制造商:Cypress Semiconductor 存儲(chǔ)容量:16 Mbit 組織:1 M x 16 訪問(wèn)時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
70V3319S166PRF8 制造商:Integrated Device Technology Inc 功能描述:SRAM Chip Sync Dual 3.3V 4.5M-Bit 256K x 18 12ns/3.6ns 128-Pin TQFP T/R 制造商:Integrated Device Technology Inc 功能描述:SRAM SYNC DUAL 3.3V 4MBIT 256KX18 12NS/3.6NS 128TQFP - Tape and Reel 制造商:Integrated Device Technology Inc 功能描述:256Kx18 STD-PWR 3.3V SYNC DUAL-PORT RAM
70V3319S166PRFG 功能描述:靜態(tài)隨機(jī)存取存儲(chǔ)器 256Kx18 STD-PWR 3.3V SYNC DUAL-PORT RAM RoHS:否 制造商:Cypress Semiconductor 存儲(chǔ)容量:16 Mbit 組織:1 M x 16 訪問(wèn)時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
70V3319S166PRFG8 制造商:Integrated Device Technology Inc 功能描述:SRAM Chip Sync Dual 3.3V 4.5M-Bit 256K x 18 12ns/3.6ns 128-Pin TQFP T/R 制造商:Integrated Device Technology Inc 功能描述:SRAM SYNC DUAL 3.3V 4MBIT 256KX18 12NS/3.6NS 128TQFP - Tape and Reel 制造商:Integrated Device Technology Inc 功能描述:256Kx18 STD-PWR 3.3V SYNC DUAL-PORT RAM
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