參數(shù)資料
型號(hào)： 73M2901CE-IMR/F
廠(chǎng)商： Maxim Integrated Products
文件頁(yè)數(shù)： 1/27頁(yè)
文件大小： 0K
描述： IC MODEM 3.3V V.22BIS 32-QFN
產(chǎn)品培訓(xùn)模塊： Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
標(biāo)準(zhǔn)包裝： 2,500
數(shù)據(jù)格式： V.21，V.22，V.23，Bell 103，Bell 212A
波特率： 300 ~ 9.6k
電源電壓： 2.7 V ~ 3.6 V
安裝類(lèi)型： 表面貼裝
封裝/外殼： 32-VFQFN 裸露焊盤(pán)
供應(yīng)商設(shè)備封裝： 32-QFN（5x5）
包裝： 帶卷 (TR)
73M2901CE
V.22bis Single Chip Modem
Simplifying System Integration
DATA SHEET
DS_2901CE_031
January 2010
Rev. 3.4
2010 Teridian Semiconductor Corporation
1
DESCRIPTION
The 73M2901CE low speed modem integrates a
data pump, controller, and analog front end in a
3.3 V device with a powerful "AT" command host
interface. The modem reduces external
component count/cost by incorporating many
features like parallel phone detect, Line-In-Use
and Ring detection in software without requiring
additional components.
The device is a "one chip fits all” solution for
applications including set-top boxes, point-of-sale
terminals, automatic teller machines, utility
meters, vending machines and smart card
readers.
Another distinctive feature of this device is pin
compatibility with Teridian’s flagship embedded
hard modems, the 73M2901CL, and the
73M1903 soft modem AFE. This offers
customers a cost effective method to design for
both hard or soft modem solutions in the same
system as a risk-free cost reduction path.
Complete support, modem reference designs
and error correction software are part of the
solution offered by Teridian. Our in-house
application engineering team is here to help
meet your international certification needs.
FEATURES
True one chip solution for embedded systems
As low as 9.5 mA operating with standby and
power down mode available
Power supply operation from 3.6 V to 2.7 V
Data modes and speeds:
V.22bis – 2400 bps
V.22/Bell212 – 1200 bps
V.21/Bell103 – 300 bps
V.23 – 1200/75 bps (with PAVI turnaround)
Bell202 – 1200 bps
Bell202/V23 1200 bps FDX 4-wire operation
V.22/Bell 212A/V.22bis synchronous modes
International Call Progress support:
FCC part 68, CTR21, JATE, etc.
DTMF generation and detection
Worldwide Caller ID capability
U.S. Type I and II support
EIA 777A compliant
SIA-2000 compliant
SMS messaging support
On chip hybrid driver
Blacklisting capability
Line-In-Use and Parallel Pick-Up (911) detection
with voltage or low cost energy detection method
Incoming ring energy detection through CID
path; no optocoupler circuitry required
Manufacturing Self Test capability
Backward compatible with 73M2901CL
Packaging: 32 lead QFN, 32-pin TQFP
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
73M2901CL 制造商:TDK 制造商全稱(chēng):TDK Electronics 功能描述:V.22 BIS SINGLE CHIP MODEM
73M2901CLIGT 制造商:TDK 制造商全稱(chēng):TDK Electronics 功能描述:V.22 BIS SINGLE CHIP MODEM
73M2901CL-IGT/F 功能描述:電信線(xiàn)路管理 IC V.22bis Single-Chip Modem w/Cid Ppu Liu RoHS:否 制造商:STMicroelectronics 產(chǎn)品:PHY 接口類(lèi)型:UART 電源電壓-最大:18 V 電源電壓-最小:8 V 電源電流:30 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VFQFPN-48 封裝:Tray
73M2901CL-IGTR/F 功能描述:電信線(xiàn)路管理 IC V.22bis Single-Chip Modem w/Cid Ppu Liu RoHS:否 制造商:STMicroelectronics 產(chǎn)品:PHY 接口類(lèi)型:UART 電源電壓-最大:18 V 電源電壓-最小:8 V 電源電流:30 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VFQFPN-48 封裝:Tray
73M2901CLIGV 制造商:TDK 制造商全稱(chēng):TDK Electronics 功能描述:V.22 BIS SINGLE CHIP MODEM
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