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參數(shù)資料
| 型號： | 73M2901CE-IMR/F |
| 廠商： | Maxim Integrated Products |
| 文件頁數(shù)： | 20/27頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC MODEM 3.3V V.22BIS 32-QFN |
| 產(chǎn)品培訓(xùn)模塊： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 標(biāo)準(zhǔn)包裝： | 2,500 |
| 數(shù)據(jù)格式： | V.21，V.22，V.23，Bell 103，Bell 212A |
| 波特率： | 300 ~ 9.6k |
| 電源電壓： | 2.7 V ~ 3.6 V |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 32-VFQFN 裸露焊盤 |
| 供應(yīng)商設(shè)備封裝： | 32-QFN（5x5） |
| 包裝： | 帶卷 (TR) |
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DS_2901CE_031
73M2901CE Data Sheet
Rev. 3.4
27
Revision History
Revision
Date
Description
2.2.1
4/20/2004
First publication.
3.1
12/14/2007
Replaced 32QFN punched with SAWN package, removed leaded package
option, updated schematic and minor clean up.
3.2
1/21/2008
Changed dimension of bottom exposed pad on 32QFN mechanical package
figure.
3.3
4/3/2009
Formatted to new Teridian style.
Assigned new document number.
Made minor corrections to Section 5.3 and Section 6.3.
3.4
1/15/2010
In Section 6.1, duplicated the hardware design considerations from the
73M2901CE Demo Board User Manual.
Moved the 73M2901CE/CL differences from the 73M2901CE Demo Board
User Manual to Section 6.4.
Replaced the schematics in Figure 3 and Figure 4 with new schematics.
Improved the charts in Figure 5 and Figure 6.
Miscellaneous editorial changes.
Teridian Semiconductor Corporation is a registered trademark of Teridian Semiconductor Corporation.
Simplifying System Integration is a trademark of Teridian Semiconductor Corporation.
All other trademarks are the property of their respective owners.
Teridian Semiconductor Corporation makes no warranty for the use of its products, other than expressly
contained in the Company’s warranty detailed in the Teridian Semiconductor Corporation standard Terms
and Conditions. The company assumes no responsibility for any errors which may appear in this
document, reserves the right to change devices or specifications detailed herein at any time without
notice and does not make any commitment to update the information contained herein. Accordingly, the
reader is cautioned to verify that this document is current by comparing it to the latest version on
http://www.teridian.com or by checking with your sales representative.
Teridian Semiconductor Corp., 6440 Oak Canyon, Suite 100, Irvine, CA 92618
TEL (714) 508-8800, FAX (714) 508-8877, http://www.teridian.com
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| 73M2901CL | 制造商:TDK 制造商全稱:TDK Electronics 功能描述:V.22 BIS SINGLE CHIP MODEM |
| 73M2901CLIGT | 制造商:TDK 制造商全稱:TDK Electronics 功能描述:V.22 BIS SINGLE CHIP MODEM |
| 73M2901CL-IGT/F | 功能描述:電信線路管理 IC V.22bis Single-Chip Modem w/Cid Ppu Liu RoHS:否 制造商:STMicroelectronics 產(chǎn)品:PHY 接口類型:UART 電源電壓-最大:18 V 電源電壓-最小:8 V 電源電流:30 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VFQFPN-48 封裝:Tray |
| 73M2901CL-IGTR/F | 功能描述:電信線路管理 IC V.22bis Single-Chip Modem w/Cid Ppu Liu RoHS:否 制造商:STMicroelectronics 產(chǎn)品:PHY 接口類型:UART 電源電壓-最大:18 V 電源電壓-最小:8 V 電源電流:30 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VFQFPN-48 封裝:Tray |
| 73M2901CLIGV | 制造商:TDK 制造商全稱:TDK Electronics 功能描述:V.22 BIS SINGLE CHIP MODEM |
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