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參數(shù)資料
| 型號： | 74HC21D |
| 英文描述： | SC70/µDFN, Single/Dual Low-Voltage, Low-Power µP Reset Circuits |
| 中文描述： | 雙4輸入與門 |
| 文件頁數(shù)： | 14/16頁 |
| 文件大小： | 83K |
| 代理商： | 74HC21D |
2003 May 14
14
Philips Semiconductors
Product specification
Dual 2-input NOR gate
74HC2G02; 74HCT2G02
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1.
For more detailed information on the BGA packages refer to the“(LF)BGA Application Note” (AN01026); order a copy
from your Philips Semiconductors sales office.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2.
3.
4.
5.
6.
PACKAGE
(1)
SOLDERING METHOD
WAVE
REFLOW
(2)
BGA, LBGA, LFBGA, SQFP, TFBGA, VFBGA
DHVQFN, HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP,
HTSSOP, HVQFN, HVSON, SMS
PLCC
(4)
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO, VSSOP
not suitable
not suitable
(3)
suitable
suitable
suitable
not recommended
(4)(5)
not recommended
(6)
suitable
suitable
suitable
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| 74HC21D(BJ) | 功能描述:AND Gate IC 2 Channel 14-SOIC 制造商:toshiba semiconductor and storage 系列:74HC 包裝:剪切帶（CT） 零件狀態(tài):在售 邏輯類型:與門 電路數(shù):2 輸入數(shù):4 特性:- 電壓 - 電源:2 V ~ 6 V 電流 - 靜態(tài)（最大值）:1μA 電流 - 輸出高，低:5.2mA，5.2mA 邏輯電平 - 低:0.5 V ~ 1.8 V 邏輯電平 - 高:1.5 V ~ 4.2 V 不同 V，最大 CL 時的最大傳播延遲:17ns @ 6V，50pF 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 供應(yīng)商器件封裝:14-SOIC 封裝/外殼:14-SOIC（0.154"，3.90mm 寬） 標(biāo)準(zhǔn)包裝:1 |
| 74HC21D,652 | 功能描述:邏輯門 DUAL 4-INPUT NAND GATE RoHS:否 制造商:Texas Instruments 產(chǎn)品:OR 邏輯系列:LVC 柵極數(shù)量:2 線路數(shù)量（輸入/輸出）:2 / 1 高電平輸出電流:- 16 mA 低電平輸出電流:16 mA 傳播延遲時間:3.8 ns 電源電壓-最大:5.5 V 電源電壓-最小:1.65 V 最大工作溫度:+ 125 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DCU-8 封裝:Reel |
| 74HC21D,653 | 功能描述:邏輯門 DUAL 4-INPUT NAND GATE RoHS:否 制造商:Texas Instruments 產(chǎn)品:OR 邏輯系列:LVC 柵極數(shù)量:2 線路數(shù)量（輸入/輸出）:2 / 1 高電平輸出電流:- 16 mA 低電平輸出電流:16 mA 傳播延遲時間:3.8 ns 電源電壓-最大:5.5 V 電源電壓-最小:1.65 V 最大工作溫度:+ 125 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DCU-8 封裝:Reel |
| 74HC21D,653-CUT TAPE | 制造商:NXP 功能描述:74HC21 Series 6 V Surface Mount Dual 4-Input AND Gate - SOIC-14 |
| 74HC21D | 制造商:NXP Semiconductors 功能描述:IC 74HC CMOS SMD 74HC21 SOIC14 |
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