參數(shù)資料
型號(hào): 74LVC1G07GW,125
廠商: NXP Semiconductors
文件頁(yè)數(shù): 17/18頁(yè)
文件大?。?/td> 0K
描述: IC BUFF OPEN DRAIN N-INV 5TSSOP
產(chǎn)品培訓(xùn)模塊: Logic Packages
標(biāo)準(zhǔn)包裝: 1
系列: 74LVC
邏輯類型: 緩沖器/線路驅(qū)動(dòng)器,非反相并帶開(kāi)漏極
元件數(shù): 1
每個(gè)元件的位元數(shù): 1
輸出電流高,低: 32mA,32mA
電源電壓: 2 V ~ 5.5 V
工作溫度: -40°C ~ 125°C
安裝類型: 表面貼裝
封裝/外殼: 6-TSSOP(5 引線),SC-88A,SOT-353
供應(yīng)商設(shè)備封裝: 5-TSSOP
包裝: 標(biāo)準(zhǔn)包裝
產(chǎn)品目錄頁(yè)面: 840 (CN2011-ZH PDF)
其它名稱: 568-2295-6
74LVC1G07
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 11 — 29 June 2012
8 of 18
NXP Semiconductors
74LVC1G07
Buffer with open-drain output
13. Package outline
Fig 10. Package outline SOT353-1 (TSSOP5)
UNIT
A1
A
max.
A2
A3
bp
L
HE
Lp
wy
v
ce
D(1)
E(1)
Z(1)
θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
0.1
0
1.0
0.8
0.30
0.15
0.25
0.08
2.25
1.85
1.35
1.15
0.65
e1
1.3
2.25
2.0
0.60
0.15
7
°
0
°
0.1
0.3
0.425
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
0.46
0.21
SOT353-1
MO-203
SC-88A
00-09-01
03-02-19
w M
bp
D
Z
e
e1
0.15
13
5
4
θ
A
A2
A1
Lp
(A3)
detail X
L
HE
E
c
v M A
X
A
y
1.5
3 mm
0
scale
TSSOP5: plastic thin shrink small outline package; 5 leads; body width 1.25 mm
SOT353-1
1.1
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