參數(shù)資料
型號(hào): 74LVC1G07GW,125
廠商: NXP Semiconductors
文件頁(yè)數(shù): 3/18頁(yè)
文件大?。?/td> 0K
描述: IC BUFF OPEN DRAIN N-INV 5TSSOP
產(chǎn)品培訓(xùn)模塊: Logic Packages
標(biāo)準(zhǔn)包裝: 1
系列: 74LVC
邏輯類(lèi)型: 緩沖器/線路驅(qū)動(dòng)器,非反相并帶開(kāi)漏極
元件數(shù): 1
每個(gè)元件的位元數(shù): 1
輸出電流高,低: 32mA,32mA
電源電壓: 2 V ~ 5.5 V
工作溫度: -40°C ~ 125°C
安裝類(lèi)型: 表面貼裝
封裝/外殼: 6-TSSOP(5 引線),SC-88A,SOT-353
供應(yīng)商設(shè)備封裝: 5-TSSOP
包裝: 標(biāo)準(zhǔn)包裝
產(chǎn)品目錄頁(yè)面: 840 (CN2011-ZH PDF)
其它名稱(chēng): 568-2295-6
74LVC1G07
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 11 — 29 June 2012
11 of 18
NXP Semiconductors
74LVC1G07
Buffer with open-drain output
Fig 13. Package outline SOT891 (XSON6)
terminal 1
index area
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
SOT891
SOT891
05-04-06
07-05-15
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1 x 0.5 mm
D
E
e1
e
A1
b
L
L1
e1
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
mm
0.20
0.12
1.05
0.95
0.35
0.27
A1
max
b
E
1.05
0.95
D
ee1
L
0.40
0.32
L1
0.35
0.55
A
max
0.5
0.04
1
6
2
5
3
4
A
6
×
(1)
4
×
(1)
Note
1. Can be visible in some manufacturing processes.
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