參數(shù)資料
型號(hào): 74LVC1G07GW/DG,125
廠商: NXP Semiconductors
文件頁(yè)數(shù): 6/18頁(yè)
文件大?。?/td> 0K
描述: IC BUFF OPEN DRAIN N-INV 5TSSOP
產(chǎn)品培訓(xùn)模塊: Logic Packages
標(biāo)準(zhǔn)包裝: 3,000
系列: 74LVC
邏輯類型: 緩沖器/線路驅(qū)動(dòng)器,非反相并帶開漏極
元件數(shù): 1
每個(gè)元件的位元數(shù): 1
輸出電流高,低: 32mA,32mA
電源電壓: 2 V ~ 5.5 V
工作溫度: -40°C ~ 125°C
安裝類型: 表面貼裝
封裝/外殼: 6-TSSOP(5 引線),SC-88A,SOT-353
供應(yīng)商設(shè)備封裝: 5-TSSOP
包裝: 帶卷 (TR)
其它名稱: 74LVC1G07GW/DG-G
74LVC1G07GW/DG-G-ND
935283543125
74LVC1G07
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 11 — 29 June 2012
14 of 18
NXP Semiconductors
74LVC1G07
Buffer with open-drain output
Fig 16. Package outline SOT1226 (X2SON5)
References
Outline
version
European
projection
Issue date
IEC
JEDEC
EIAJ
SOT1226
sot1226_po
12-04-10
12-04-25
Unit
mm
max
nom
min
0.35
0.85
0.80
0.75
0.04
0.30
0.25
0.20
0.85
0.80
0.75
0.27
0.22
0.17
0.05
A(1)
Dimensions
Note
1. Dimension A is including plating thickness.
2. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
SOT1226
A1
A3
0.128
0.040
DDh
Eb
e
0.48
kLv
0.1
wy
0.05
scale
01 mm
X
terminal 1
index area
D
E
A
B
detail X
A
A1
A3
C
y
C
y1
54
terminal 1
index area
D h
L
b
k
e
A
C
B
v
C
w
2
1
0.20
0.27
0.22
0.17
y1
X2SON5: plastic thermal enhanced extremely thin small outline package; no leads;
5 terminals; body 0.8 x 0.8 x 0.35 mm
3
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