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參數(shù)資料
| 型號： | 74LVC1G19 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | Quadruple 2-Input Exclusive-NOR Gates With Open-Drain Outputs 14-SOIC -40 to 85 |
| 中文描述： | 具有開漏輸出四2輸入異或非門，14-SOIC封裝, -40℃到85℃ |
| 文件頁數(shù)： | 2/17頁 |
| 文件大?。?/td> | 91K |
| 代理商： | 74LVC1G19 |
9397 750 13762
Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet
Rev. 01 — 18 October 2004
2 of 17
Philips Semiconductors
74LVC1G175
Single D-type flip-flop with reset; positive-edge trigger
3.
Quick reference data
[1]
C
PD
is used to determine the dynamic power dissipation (P
D
in
μ
W).
P
D
= C
PD
×
V
CC2
×
f
i
×
N +
Σ
(C
L
×
V
CC2
×
f
o
) where:
f
i
= input frequency in MHz;
f
o
= output frequency in MHz;
C
L
= output load capacitance in pF;
V
CC
= supply voltage in Volts;
N = number of inputs switching;
Σ
(C
L
×
V
CC2
×
f
o
) = sum of the outputs.
The condition is V
I
= GND to V
CC
.
[2]
4.
Ordering information
5.
Functional diagram
Table 1:
GND = 0 V; T
amb
= 25
°
C; t
r
= t
f
≤
2.5 ns.
Symbol
Parameter
t
PHL
, t
PLH
propagation delay
CP to Q
propagation delay
MR to Q
f
max
maximum clock
frequency
C
I
input capacitance
C
PD
power dissipation
capacitance
Quick reference data
Conditions
C
L
= 50 pF; V
CC
= 3.3 V
Min
1.0
Typ
3.1
Max
5.7
Unit
ns
C
L
= 50 pF; V
CC
= 3.3 V
1.0
2.5
5.8
ns
C
L
= 50 pF; V
CC
= 3.3 V
175
300
-
MHz
-
2.5
14
-
-
pF
pF
V
CC
= 3.3 V
[1] [2]
-
Table 2:
Type number
Ordering information
Package
Temperature range
74LVC1G175GW
74LVC1G175GV
74LVC1G175GM
Name
SC-88
SC-74
XSON6
Description
plastic surface mounted package; 6 leads
plastic surface mounted package; 6 leads
plastic extremely thin small outline package; no
leads; 6 terminals; body 1
×
1.45
×
0.5 mm
Version
SOT363
SOT457
SOT886
40
°
C to +125
°
C
40
°
C to +125
°
C
40
°
C to +125
°
C
Fig 1.
Logic symbol.
Fig 2.
IEC logic symbol.
001aaa468
FF
MR
Q
4
3
6
1
CP
D
001aaa469
1
3
C1
1D
6
R
4
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