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參數資料
| 型號： | 853S314AGILFT |
| 廠商： | INTEGRATED DEVICE TECHNOLOGY INC |
| 元件分類： | 時鐘及定時 |
| 英文描述： | 853S SERIES, LOW SKEW CLOCK DRIVER, 4 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), PDSO20 |
| 封裝： | 4.40 MM X 6.50 MM, 0.925 MM HEIGHT, ROHS COMPLIANT, MO-153, TSSOP-20 |
| 文件頁數： | 2/16頁 |
| 文件大?。?/td> | 282K |
| 代理商： | 853S314AGILFT |
IDT / ICS 3.3V, 2.5V LVPECL/ECL FANOUT BUFFER
10
ICS853S314AFI REV. A JANUARY 24, 2009
ICS853S314I
LOW SKEW, 1-TO-4 DIFFERENTIAL-TO-2.5V, 3.3V LVPECL/ECL FANOUT BUFFER
POWER CONSIDERATIONS
This section provides information on power dissipation and junction temperature for the ICS853S314I.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS853S314I is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for V
CC
= 3.465V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
Power (core)
MAX
= V
CC_MAX
* I
EE_MAX
= 3.465V * 92mA = 318.78mW
Power (outputs)
MAX
= 33mW/Loaded Output pair
If all outputs are loaded, the total power is 4 * 33mW = 132mW
Total Power
_MAX
(3.465V, with all outputs switching) = 318.78mW + 132mW = 450.78mW
2.
Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the
device. The maximum recommended junction temperature for HiPerClockS
TM devices is 125°C.
The equation for Tj is as follows: Tj =
θ
JA * Pd_total + TA
Tj = Junction Temperature
θ
JA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
T
A = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
θ
JA must be used. Assuming a
moderate air flow of 200 linear feet per minute and a multi-layer board, the appropriate value is 66.6°C/W per Table 6A below.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
85°C + 0.450W * 90.4°C/W = 125°C. This is within the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow,
and the type of board (single layer or multi-layer).
θθθθθ
JA
by Velocity (Linear Feet per Minute)
0
200
500
Multi-Layer PCB, JEDEC Standard Test Boards
94.8°C/W
90.4°C/W
88.3°C/W
TABLE 6A. THERMAL RESISTANCE
θθθθθ
JA
FOR
20-PIN TSSOP, FORCED CONVECTION
TABLE 6B. THERMAL RESISTANCE
θθθθθ
JA
FOR
20-PIN SSOP, FORCED CONVECTION
θθθθθ
JA
by Velocity (Linear Feet per Minute)
0
200
500
Multi-Layer PCB, JEDEC Standard Test Boards
80.8°C/W
73.2°C/W
69.2°C/W
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