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參數(shù)資料
| 型號： | 934056343127 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 外設(shè)及接口 |
| 英文描述： | 18 A BUF OR INV BASED PRPHL DRVR, PZFM5 |
| 封裝： | PLASTIC, TO-220, SOT-263B-01, 5 PIN |
| 文件頁數(shù)： | 11/16頁 |
| 文件大小： | 412K |
| 代理商： | 934056343127 |
Philips Semiconductors
BUK208-50Y; BUK213-50Y
Single channel high-side TOPFET
Product data
Rev. 02 — 06 June 2002
4 of 16
9397 750 09384
Koninklijke Philips Electronics N.V. 2002. All rights reserved.
5.
Limiting values
[1]
Reverse battery voltage is only allowed with external resistors to limit the input and status currents to a safe value. The connected load
must limit the reverse current. The internal ground resistor limits the reverse battery ground current.
[2]
To limit input current during reverse battery and transient overvoltages.
[3]
To limit status current during reverse battery and transient overvoltages.
6.
Thermal characteristics
Table 4:
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VBG
continuous supply voltage
-
50
V
IL
continuous load current
Tmb ≤ 112 °C
-
8.5
A
Ptot
total power dissipation
Tmb ≤ 25 °C
-
48
W
Tstg
storage temperature
55
+175
°C
Tj
junction temperature
-
150
°C
Tmb
mounting base temperature
during soldering (
≤ 10 s)
-
260
°C
Reverse battery voltage
VBG
continuous reverse voltage
-16
V
VBG
repetitive reverse voltage
-
32
V
External resistor
RI
external resistor
3.3
-
k
RS
3.3
-
k
Input current
II
continuous current
5+5
mA
II
repetitive peak current
δ≤ 0.1; tp = 300 s
50
+50
mA
Status current
IS
continuous current
5+5
mA
IS
repetitive peak current
δ≤ 0.1; tp = 300 s
50
+50
mA
Inductive load clamping
EBL(CL)
non-repetitive clamping energy
Tj = 150 °C prior to turn-off; IL = 2 A
-
100
mJ
Electrostatic discharge
Vesd
electrostatic discharge voltage
Human body model; C = 100 pF;
R = 1.5 k
-2
kV
Table 5:
Thermal characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Rth(j-mb)
thermal resistance from junction to
mounting base
-
2.1
2.6
K/W
Rth(j-a)
thermal resistance from junction to
ambient
mounted on printed circuit board;
minimum footprint; SOT426
--50
K/W
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