參數(shù)資料
型號: 934057041118
廠商: NXP SEMICONDUCTORS
元件分類: JFETs
英文描述: 75 A, 60 V, 0.0036 ohm, N-CHANNEL, Si, POWER, MOSFET
封裝: PLASTIC, SMD, D2PAK-3
文件頁數(shù): 5/12頁
文件大?。?/td> 279K
代理商: 934057041118
Philips Semiconductors
PSMN004-60P/60B
N-channel enhancement mode eld-effect transistor
Product data
Rev. 01 — 26 April 2002
2 of 13
9397 750 09156
Koninklijke Philips Electronics N.V. 2002. All rights reserved.
5.
Quick reference data
6.
Limiting values
Table 2:
Quick reference data
Symbol Parameter
Conditions
Typ
Max
Unit
VDS
drain-source voltage (DC)
25
°C ≤ T
j ≤ 175 °C
-
60
V
ID
drain current (DC)
Tmb =25 °C; VGS =10V
-
75
A
Ptot
total power dissipation
Tmb =25 °C
-
230
W
Tj
junction temperature
-
175
°C
RDSon
drain-source on-state resistance
VGS = 10 V; ID = 25 A; Tj =25 °C
3.1
3.6
m
Table 3:
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
Min
Max
Unit
VDS
drain-source voltage (DC)
25
°C ≤ Tj ≤ 175 °C
-
60
V
VDGR
drain-gate voltage (DC)
25
°C ≤ Tj ≤ 175 °C; RGS =20k
-60
V
VGS
gate-source voltage (DC)
-
±20
V
VGSM
gate-source voltage
tp ≤ 50 s; pulsed;
duty cycle 25%; Tj ≤ 150 °C
-
±30
V
ID
drain current (DC)
Tmb =25 °C; VGS =10V; Figure 2 and 3
-75
A
Tmb = 100 °C; VGS =10V; Figure 2
-75
A
IDM
peak drain current
Tmb =25 °C; pulsed; tp ≤ 10 s; Figure 3
-
400
A
Ptot
total power dissipation
Tmb =25 °C; Figure 1
-
230
W
Tstg
storage temperature
55
+175
°C
Tj
junction temperature
55
+175
°C
Source-drain diode
IS
source (diode forward) current (DC) Tmb =25 °C
-
75
A
ISM
peak source (diode forward) current Tmb =25 °C; pulsed; tp ≤ 10 s
-
400
A
Avalanche ruggedness
EDS(AL)S non-repetitive avalanche energy
unclamped inductive load;
ID =75A;tp = 0.1 ms; VDD =15V;
RGS =50 ; VGS = 10 V; starting Tj =25 °C
-
500
mJ
IDS(AL)S
non-repetitive avalanche current
unclamped inductive load;
VDD =15V;RGS =50 ; VGS =10V;
starting Tj =25 °C
-75
A
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