參數(shù)資料
型號(hào)： 935198040551
廠商： NXP SEMICONDUCTORS
元件分類： 數(shù)字傳輸電路
英文描述： CLOCK RECOVERY CIRCUIT, PQFP48
封裝： PLASTIC, SOT-313, LQFP-48
文件頁數(shù)： 22/38頁
文件大?。?/td> 209K
代理商： 935198040551
1999 May 27
29
Philips Semiconductors
Product specication
SDH/SONET data and clock recovery unit
STM1/4/16 OC3/12/48 GE
OQ2541HP; OQ2541U
Table 6
Bonding pad locations.
SYMBOL
PAD
COORDINATES(1)
xy
ENL
1
1017.5
+852.5
GND
2
1017.5
+697.5
CLOOP
3
1017.5
+542.5
CLOOPQ
4
1017.5
+387.5
GND
5
1017.5
+232.5
DLOOP
6
1017.5
+77.5
DLOOPQ
7
1017.5
77.5
GND
8
1017.5
232.5
DREF19
9
1017.5
387.5
GND
10
1017.5
542.5
GND
11
1017.5
697.5
LOCK
12
1017.5
852.5
i.c.
13
852.5
1017.5
GND
14
697.5
1017.5
CAPUPQ
15
542.5
1017.5
CAPDOQ
16
387.5
1017.5
GND
17
232.5
1017.5
i.c.
18
77.5
1017.5
i.c.
19
+77.5
1017.5
GND
20
+232.5
1017.5
CREF
21
+387.5
1017.5
CREFQ
22
+542.5
1017.5
GND
23
+697.5
1017.5
DREF39
24
+852.5
1017.5
VEE1
25
+1017.5
852.5
GND
26
+1017.5
697.5
DOUT1250
27
+1017.5
542.5
DOUT622
28
+1017.5
387.5
GND
29
+1017.5
232.5
DOUT155
30
+1017.5
77.5
VEE2
31
+1017.5
+77.5
GND
32
+1017.5
+232.5
DIN
33
+1017.5
+387.5
DINQ
34
+1017.5
+542.5
GND
35
+1017.5
+697.5
i.c.
36
+1017.5
+852.5
PC
37
+852.5
+1017.5
GND
38
+697.5
+1017.5
Note
1. All x and y coordinates represent the position of the
centre of the pad in
m with respect to the centre of the
die (see Fig.30).
LOS
39
+542.5
+1017.5
i.c.
40
+387.5
+1017.5
GND
41
+232.5
+1017.5
DOUT
42
+77.5
+1017.5
DOUTQ
43
77.5
+1017.5
GND
44
232.5
+1017.5
COUT
45
387.5
+1017.5
COUTQ
46
542.5
+1017.5
GND
47
697.5
+1017.5
AREF
48
852.5
+1017.5
SYMBOL
PAD
COORDINATES(1)
xy
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