參數(shù)資料
型號(hào)： 935198040551
廠商： NXP SEMICONDUCTORS
元件分類： 數(shù)字傳輸電路
英文描述： CLOCK RECOVERY CIRCUIT, PQFP48
封裝： PLASTIC, SOT-313, LQFP-48
文件頁(yè)數(shù)： 5/38頁(yè)
文件大?。?/td> 209K
代理商： 935198040551
1999 May 27
13
Philips Semiconductors
Product specication
SDH/SONET data and clock recovery unit
STM1/4/16 OC3/12/48 GE
OQ2541HP; OQ2541U
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
HANDLING INSTRUCTIONS
Precautions should be taken to avoid damage through electrostatic discharge. This is particularly important during
assembly and handling of the bare die. Additional safety can be obtained by bonding the VEE and GND pads first, the
remaining pads may then be bonded to their external connections in any order.
THERMAL CHARACTERISTICS
Note
1. Thermal resistance from junction to ambient is determined with the IC soldered on a standard single sided
57
× 57 × 1.6 mm FR4 epoxy PCB with 35 m thick copper traces. The measurements are performed in still air.
SYMBOL
PARAMETER
MIN.
MAX.
UNIT
VEE
negative supply voltage
6
+0.5
V
Vn
DC voltage on pins
CLOOP, CLOOPQ, DLOOP, DLOOPQ, CREF, CREFQ, DIN, DINQ,
DOUT, DOUTQ, COUT and COUTQ
1
+0.5
V
ENL, LOCK and LOS,
VEE 0.5 +5.5
V
DREF19, DREF39, DOUT1250, DOUT622, DOUT155, PC and AREF VEE 0.5 +0.5
V
CAPUPQ and CAPDOQ
VEE + 0.5 0.5
V
In
input current on pins
ENL
1mA
CREF, CREFQ, DIN and DINQ
20
+10
mA
Ptot
total power dissipation
700
mW
Tamb
ambient temperature
40
+85
°C
Tj
junction temperature
40
+110
°C
Tstg
storage temperature
65
+150
°C
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
Rth(j-s)
thermal resistance from junction to solder point
46
K/W
Rth(j-a)
thermal resistance from junction to ambient
in free air; note 1
67
K/W
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