參數(shù)資料
型號(hào): 935230900112
廠商: NXP SEMICONDUCTORS
元件分類(lèi): 微控制器/微處理器
英文描述: 2 CHANNEL(S), 1M bps, LOCAL AREA NETWORK CONTROLLER, PDIP28
封裝: 0.600 INCH, PLASTIC, DIP-28
文件頁(yè)數(shù): 12/68頁(yè)
文件大?。?/td> 234K
代理商: 935230900112
2000 Jan 04
2
Philips Semiconductors
Product specication
Stand-alone CAN controller
SJA1000
CONTENTS
1
FEATURES
2
GENERAL DESCRIPTION
3
ORDERING INFORMATION
4
BLOCK DIAGRAM
5
PINNING
6
FUNCTIONAL DESCRIPTION
6.1
Description of the CAN controller blocks
6.1.1
Interface Management Logic (IML)
6.1.2
Transmit Buffer (TXB)
6.1.3
Receive Buffer (RXB, RXFIFO)
6.1.4
Acceptance Filter (ACF)
6.1.5
Bit Stream Processor (BSP)
6.1.6
Bit Timing Logic (BTL)
6.1.7
Error Management Logic (EML)
6.2
Detailed description of the CAN controller
6.2.1
PCA82C200 compatibility
6.2.2
Differences between BasicCAN and PeliCAN
mode
6.3
BasicCAN mode
6.3.1
BasicCAN address layout
6.3.2
Reset values
6.3.3
Control Register (CR)
6.3.4
Command Register (CMR)
6.3.5
Status Register (SR)
6.3.6
Interrupt Register (IR)
6.3.7
Transmit buffer layout
6.3.8
Receive buffer
6.3.9
Acceptance filter
6.4
PeliCAN mode
6.4.1
PeliCAN address layout
6.4.2
Reset values
6.4.3
Mode Register (MOD)
6.4.4
Command Register (CMR)
6.4.5
Status Register (SR)
6.4.6
Interrupt Register (IR)
6.4.7
Interrupt Enable Register (IER)
6.4.8
Arbitration Lost Capture register (ALC)
6.4.9
Error Code Capture register (ECC)
6.4.10
Error Warning Limit Register (EWLR)
6.4.11
RX Error Counter Register (RXERR)
6.4.12
TX Error Counter Register (TXERR)
6.4.13
Transmit buffer
6.4.14
Receive buffer
6.4.15
Acceptance filter
6.4.16
RX Message Counter (RMC)
6.4.17
RX Buffer Start Address register (RBSA)
6.5
Common registers
6.5.1
Bus Timing Register 0 (BTR0)
6.5.2
Bus Timing Register 1 (BTR1)
6.5.3
Output Control Register (OCR)
6.5.4
Clock Divider Register (CDR)
7
LIMITING VALUES
8
THERMAL CHARACTERISTICS
9
DC CHARACTERISTICS
10
AC CHARACTERISTICS
10.1
AC timing diagrams
10.2
Additional AC information
11
PACKAGE OUTLINES
12
SOLDERING
12.1
Introduction
12.2
DIP
12.2.1
Soldering by dipping or by wave
12.2.2
Repairing soldered joints
12.3
SO
12.3.1
Reflow soldering
12.3.2
Wave soldering
12.3.3
Repairing soldered joints
13
DEFINITIONS
14
LIFE SUPPORT APPLICATIONS
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