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參數資料
| 型號： | 935270020151 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 2 CHANNEL(S), 5M bps, SERIAL COMM CONTROLLER, PQFP48 |
| 封裝： | 7 X 7 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT-313-2, LQFP-48 |
| 文件頁數： | 38/51頁 |
| 文件大?。?/td> | 667K |
| 代理商： | 935270020151 |
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Philips Semiconductors
SC16C2550
Dual UART with 16 bytes of transmit and receive FIFOs
and infrared (IrDA) encoder/decoder
Product data
Rev. 02 — 14 March 2003
43 of 47
9397 750 11204
Koninklijke Philips Electronics N.V. 2003. All rights reserved.
For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be
parallel to the transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the
transport direction of the printed-circuit board.
The footprint must incorporate solder thieves at the downstream end.
For packages with leads on four sides, the footprint must be placed at a 45
° angle
to the transport direction of the printed-circuit board. The footprint must
incorporate solder thieves downstream and at the side corners.
During placement and before soldering, the package must be xed with a droplet of
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive is cured.
Typical dwell time is 4 seconds at 250
°C. A mildly-activated ux will eliminate the
need for removal of corrosive residues in most applications.
12.2.3
Manual soldering
Fix the component by rst soldering two diagonally-opposite end leads. Use a low
voltage (24 V or less) soldering iron applied to the at part of the lead. Contact time
must be limited to 10 seconds at up to 300
°C.
When using a dedicated tool, all other leads can be soldered in one operation within
2 to 5 seconds between 270 and 320
°C.
12.3 Through-hole mount packages
12.3.1
Soldering by dipping or by solder wave
The maximum permissible temperature of the solder is 260
°C; solder at this
temperature must not be in contact with the joints for more than 5 seconds. The total
contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the
plastic body must not exceed the specied maximum storage temperature (Tstg(max)).
If the printed-circuit board has been pre-heated, forced cooling may be necessary
immediately after soldering to keep the temperature within the permissible limit.
12.3.2
Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the
seating plane or not more than 2 mm above it. If the temperature of the soldering iron
bit is less than 300
°C it may remain in contact for up to 10 seconds. If the bit
temperature is between 300 and 400
°C, contact may be up to 5 seconds.
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