參數(shù)資料
型號: 93C56AMS
廠商: Microchip Technology Inc.
英文描述: IGBT Module; Continuous Collector Current, Ic:30A; Collector Emitter Saturation Voltage, Vce(sat):2.1V; Power Dissipation, Pd:60.6W; Collector Current:30A; Collector Emitter Voltage, Vceo:600V; Package/Case:DIP-41
中文描述: 2K微絲兼容串行EEPROM
文件頁數(shù): 15/24頁
文件大?。?/td> 405K
代理商: 93C56AMS
2003 Microchip Technology Inc.
DS21794B-page 15
93AA56A/B/C, 93LC56A/B/C, 93C56A/B/C
8-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
B1
B
A1
A
L
A2
p
α
E
eB
β
c
E1
n
D
1
2
Units
INCHES*
NOM
MILLIMETERS
NOM
Dimension Limits
MIN
MAX
MIN
MAX
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
n
p
A
A2
A1
E
E1
D
L
c
B1
B
eB
α
β
8
8
.100
.155
.130
2.54
3.94
3.30
.140
.115
.015
.300
.240
.360
.125
.008
.045
.014
.310
.170
.145
3.56
2.92
0.38
7.62
6.10
9.14
3.18
0.20
1.14
0.36
7.87
4.32
3.68
.313
.250
.373
.130
.012
.058
.018
.370
10
10
.325
.260
.385
.135
.015
.070
.022
.430
15
15
7.94
6.35
3.30
0.29
1.46
0.46
9.40
10
10
8.26
6.60
9.78
3.43
0.38
1.78
0.56
10.92
§
5
5
5
5
15
15
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-018
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