(Wor s t - C as e M i l i t a r y Cond i t i o n s , V CC <" />
參數(shù)資料
型號(hào): A1010B-PQG100C
廠商: Microsemi SoC
文件頁數(shù): 48/98頁
文件大?。?/td> 0K
描述: IC FPGA 1200 GATES 100-PQFP COM
標(biāo)準(zhǔn)包裝: 66
系列: ACT™ 1
LAB/CLB數(shù): 295
輸入/輸出數(shù): 57
門數(shù): 1200
電源電壓: 4.5 V ~ 5.5 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 70°C
封裝/外殼: 100-BQFP
供應(yīng)商設(shè)備封裝: 100-PQFP(14x20)
52
A3 22 00 DX Ti m i n g Ch ar ac te r i st i c s
(Wor s t - C as e M i l i t a r y Cond i t i o n s , V CC = 4.5 V, TJ = 1 25°C)
‘–1’ Speed
‘Std’ Speed
Parameter
Description
Min.
Max.
Min.
Max.
Units
Logic Module Combinatorial Functions
tPD
Internal Array Module Delay
2.8
3.8
ns
tPDD
Internal Decode Module Delay
3.4
4.6
ns
Logic Module Predicted Routing Delays1
tRD1
FO=1 Routing Delay
1.6
2.1
ns
tRD2
FO=2 Routing Delay
2.3
3.1
ns
tRD3
FO=3 Routing Delay
2.9
3.9
ns
tRD4
FO=4 Routing Delay
3.5
4.7
ns
tRD5
FO=8 Routing Delay
6.2
8.2
ns
tRDD
Decode-to-Output Routing Delay
0.8
1.1
ns
Logic Module Sequential Timing Characteristics
tCO
Flip-Flop Clock-to-Output
3.2
4.2
ns
tGO
Latch Gate-to-Output
2.8
3.8
ns
tSU
Flip-Flop (Latch) Setup Time
0.5
0.6
ns
tH
Flip-Flop (Latch) Hold Time
0.0
ns
tRO
Flip-Flop (Latch) Reset to Output
3.2
4.2
ns
tSUENA
Flip-Flop (Latch) Enable Setup
0.9
1.2
ns
tHENA
Flip-Flop (Latch) Enable Hold
0.0
ns
tWCLKA
Flip-Flop (Latch) Clock Active Pulse Width
4.3
5.8
ns
tWASYN
Flip-Flop (Latch) Asynchronous Pulse Width
5.7
7.6
ns
Note:
1.
Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating device
performance. Post-route timing analysis or simulation is required to determine actual worst-case performance. Post-route timing is
based on actual routing delay measurements performed on the device prior to shipment.
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A1010B-PQG100I 功能描述:IC FPGA 1200 GATES 100-PQFP IND RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門陣列) 系列:ACT™ 1 標(biāo)準(zhǔn)包裝:40 系列:SX-A LAB/CLB數(shù):6036 邏輯元件/單元數(shù):- RAM 位總計(jì):- 輸入/輸出數(shù):360 門數(shù):108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FPBGA(27X27)
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