Revision 13 1-5 SRAM and FIFO ProASIC3E devices have embedded SRAM blocks along their north and south sides. E" />
參數(shù)資料
型號： A3PE3000-FGG324
廠商： Microsemi SoC
文件頁數(shù)： 13/162頁
文件大?。?/td> 0K
描述： IC FPGA 1KB FLASH 3M 324-FBGA
標(biāo)準(zhǔn)包裝： 84
系列： ProASIC3E
RAM 位總計： 516096
輸入/輸出數(shù)： 221
門數(shù)： 3000000
電源電壓： 1.425 V ~ 1.575 V
安裝類型： 表面貼裝
工作溫度： 0°C ~ 70°C
封裝/外殼： 324-BGA
供應(yīng)商設(shè)備封裝： 324-FBGA（19x19）
ProASIC3E Flash Family FPGAs
Revision 13
1-5
SRAM and FIFO
ProASIC3E devices have embedded SRAM blocks along their north and south sides. Each variable-
aspect-ratio SRAM block is 4,608 bits in size. Available memory configurations are 256×18, 512×9,
1k×4, 2k×2, and 4k×1 bits. The individual blocks have independent read and write ports that can be
configured with different bit widths on each port. For example, data can be sent through a 4-bit port and
read as a single bitstream. The embedded SRAM blocks can be initialized via the device JTAG port
(ROM emulation mode) using the UJTAG macro.
In addition, every SRAM block has an embedded FIFO control unit. The control unit allows the SRAM
block to be configured as a synchronous FIFO without using additional core VersaTiles. The FIFO width
and depth are programmable. The FIFO also features programmable Almost Empty (AEMPTY) and
Almost Full (AFULL) flags in addition to the normal Empty and Full flags. The embedded FIFO control
unit contains the counters necessary for generation of the read and write address pointers. The
embedded SRAM/FIFO blocks can be cascaded to create larger configurations.
PLL and CCC
ProASIC3E devices provide designers with very flexible clock conditioning capabilities. Each member of
the ProASIC3E family contains six CCCs, each with an integrated PLL.
The six CCC blocks are located at the four corners and the centers of the east and west sides.
To maximize user I/Os, only the center east and west PLLs are available in devices using the PQ208
package. However, all six CCC blocks are still usable; the four corner CCCs allow simple clock delay
operations as well as clock spine access.
The inputs of the six CCC blocks are accessible from the FPGA core or from one of several inputs
located near the CCC that have dedicated connections to the CCC block.
The CCC block has these key features:
Wide input frequency range (fIN_CCC) = 1.5 MHz to 350 MHz
Output frequency range (fOUT_CCC) = 0.75 MHz to 350 MHz
Clock delay adjustment via programmable and fixed delays from –7.56 ns to +11.12 ns
2 programmable delay types for clock skew minimization
Clock frequency synthesis
Additional CCC specifications:
Internal phase shift = 0°, 90°, 180°, and 270°. Output phase shift depends on the output divider
configuration.
Output duty cycle = 50% ± 1.5% or better
Low output jitter: worst case < 2.5% × clock period peak-to-peak period jitter when single global
network used
Maximum acquisition time = 300 s
Low power consumption of 5 mW
Exceptional tolerance to input period jitter— allowable input jitter is up to 1.5 ns
Four precise phases; maximum misalignment between adjacent phases of 40 ps × (350 MHz /
fOUT_CCC)
Global Clocking
ProASIC3E devices have extensive support for multiple clocking domains. In addition to the CCC and
PLL support described above, there is a comprehensive global clock distribution network.
Each VersaTile input and output port has access to nine VersaNets: six chip (main) and three quadrant
global networks. The VersaNets can be driven by the CCC or directly accessed from the core via
multiplexers (MUXes). The VersaNets can be used to distribute low-skew clock signals or for rapid
distribution of high fanout nets.
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