2-56 Revision 13 Input Register Timing Characteristics Figure 2-27 Input Register" />
參數(shù)資料
型號: A3PE3000-FGG324
廠商: Microsemi SoC
文件頁數(shù): 131/162頁
文件大?。?/td> 0K
描述: IC FPGA 1KB FLASH 3M 324-FBGA
標(biāo)準(zhǔn)包裝: 84
系列: ProASIC3E
RAM 位總計: 516096
輸入/輸出數(shù): 221
門數(shù): 3000000
電源電壓: 1.425 V ~ 1.575 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 70°C
封裝/外殼: 324-BGA
供應(yīng)商設(shè)備封裝: 324-FBGA(19x19)
ProASIC3E DC and Switching Characteristics
2-56
Revision 13
Input Register
Timing Characteristics
Figure 2-27 Input Register Timing Diagram
50%
Preset
Clear
Out_1
CLK
Data
Enable
t
ISUE
50%
t
ISUD
t
IHD
50%
t
ICLKQ
1
0
t
IHE
t
IRECPRE
t
IREMPRE
t
IRECCLR
t
IREMCLR
t
IWCLR
t
IWPRE
t
IPRE2Q
t
ICLR2Q
t
ICKMPWH tICKMPWL
50%
Table 2-86 Input Data Register Propagation Delays
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V
Parameter
Description
–2
–1
Std. Units
tICLKQ
Clock-to-Q of the Input Data Register
0.24 0.27 0.32
ns
tISUD
Data Setup Time for the Input Data Register
0.26 0.30 0.35
ns
tIHD
Data Hold Time for the Input Data Register
0.00 0.00 0.00
ns
tISUE
Enable Setup Time for the Input Data Register
0.37 0.42 0.50
ns
tIHE
Enable Hold Time for the Input Data Register
0.00 0.00 0.00
ns
tICLR2Q
Asynchronous Clear-to-Q of the Input Data Register
0.45 0.52 0.61
ns
tIPRE2Q
Asynchronous Preset-to-Q of the Input Data Register
0.45 0.52 0.61
ns
tIREMCLR
Asynchronous Clear Removal Time for the Input Data Register
0.00 0.00 0.00
ns
tIRECCLR
Asynchronous Clear Recovery Time for the Input Data Register
0.22 0.25 0.30
ns
tIREMPRE
Asynchronous Preset Removal Time for the Input Data Register
0.00 0.00 0.00
ns
tIRECPRE
Asynchronous Preset Recovery Time for the Input Data Register
0.22 0.25 0.30
ns
tIWCLR
Asynchronous Clear Minimum Pulse Width for the Input Data Register
0.22 0.25 0.30
ns
tIWPRE
Asynchronous Preset Minimum Pulse Width for the Input Data Register
0.22 0.25 0.30
ns
tICKMPWH
Clock Minimum Pulse Width High for the Input Data Register
0.36 0.41 0.48
ns
tICKMPWL
Clock Minimum Pulse Width Low for the Input Data Register
0.32 0.37 0.43
ns
Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-5 for derating values.
相關(guān)PDF資料
PDF描述
A3PE3000-FG324 IC FPGA 1KB FLASH 3M 324-FBGA
HBC65DRAS-S734 CONN EDGECARD 130PS .100 R/A PCB
M1A3PE3000-FGG324 IC FPGA 1KB FLASH 3M 324-FBGA
FMC17DRAI CONN EDGECARD 34POS R/A .100 SLD
SST39VF040-70-4C-NHE IC FLASH MPF 4MBIT 70NS 32PLCC
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
A3PE3000-FGG324I 功能描述:IC FPGA 1KB FLASH 3M 324-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:ProASIC3E 標(biāo)準(zhǔn)包裝:1 系列:ProASICPLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:129024 輸入/輸出數(shù):248 門數(shù):600000 電源電壓:2.3 V ~ 2.7 V 安裝類型:表面貼裝 工作溫度:- 封裝/外殼:352-BFCQFP,帶拉桿 供應(yīng)商設(shè)備封裝:352-CQFP(75x75)
A3PE3000-FGG484 功能描述:IC FPGA 620I/O 484FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:ProASIC3E 標(biāo)準(zhǔn)包裝:60 系列:XP LAB/CLB數(shù):- 邏輯元件/單元數(shù):10000 RAM 位總計:221184 輸入/輸出數(shù):244 門數(shù):- 電源電壓:1.71 V ~ 3.465 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:388-BBGA 供應(yīng)商設(shè)備封裝:388-FPBGA(23x23) 其它名稱:220-1241
A3PE3000-FGG484I 功能描述:IC FPGA 1KB FLASH 3M 484-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:ProASIC3E 標(biāo)準(zhǔn)包裝:1 系列:ProASICPLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:129024 輸入/輸出數(shù):248 門數(shù):600000 電源電壓:2.3 V ~ 2.7 V 安裝類型:表面貼裝 工作溫度:- 封裝/外殼:352-BFCQFP,帶拉桿 供應(yīng)商設(shè)備封裝:352-CQFP(75x75)
A3PE3000-FGG896 功能描述:IC FPGA 1KB FLASH 3M 896-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:ProASIC3E 產(chǎn)品培訓(xùn)模塊:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色產(chǎn)品:Cyclone? IV FPGAs 標(biāo)準(zhǔn)包裝:60 系列:CYCLONE® IV GX LAB/CLB數(shù):9360 邏輯元件/單元數(shù):149760 RAM 位總計:6635520 輸入/輸出數(shù):270 門數(shù):- 電源電壓:1.16 V ~ 1.24 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FBGA(23x23)
A3PE3000-FGG896ES 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:ProASIC3E Flash Family FPGAs