2-48 Revision 13 Differential I/O Characteristics Physical Implementation Configuration of the I" />
參數(shù)資料
型號: A3PE3000-FGG896
廠商: Microsemi SoC
文件頁數(shù): 122/162頁
文件大小: 0K
描述: IC FPGA 1KB FLASH 3M 896-FBGA
標(biāo)準(zhǔn)包裝: 27
系列: ProASIC3E
RAM 位總計: 516096
輸入/輸出數(shù): 620
門數(shù): 3000000
電源電壓: 1.425 V ~ 1.575 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 70°C
封裝/外殼: 896-BGA
供應(yīng)商設(shè)備封裝: 896-FBGA(31x31)
ProASIC3E DC and Switching Characteristics
2-48
Revision 13
Differential I/O Characteristics
Physical Implementation
Configuration of the I/O modules as a differential pair is handled by the Designer software when the user
instantiates a differential I/O macro in the design.
Differential I/Os can also be used in conjunction with the embedded Input Register (InReg), Output
Register (OutReg), Enable Register (EnReg), and DDR. However, there is no support for bidirectional
I/Os or tristates with the LVPECL standards.
LVDS
Low-Voltage Differential Signaling (ANSI/TIA/EIA-644) is a high-speed, differential I/O standard. It
requires that one data bit be carried through two signal lines, so two pins are needed. It also requires
external resistor termination.
The full implementation of the LVDS transmitter and receiver is shown in an example in Figure 2-22. The
building blocks of the LVDS transmitter-receiver are one transmitter macro, one receiver macro, three
board resistors at the transmitter end, and one resistor at the receiver end. The values for the three driver
resistors are different from those used in the LVPECL implementation because the output standard
specifications are different.
Along with LVDS I/O, ProASIC3E also supports Bus LVDS structure and Multipoint LVDS (M-LVDS)
configuration (up to 40 nodes).
Figure 2-22 LVDS Circuit Diagram and Board-Level Implementation
140
100
Z0 = 50
165
165
+
P
N
P
N
INBUF_LVDS
OUTBUF_LVDS
FPGA
Bourns Part Number: CAT16-LV4F12
相關(guān)PDF資料
PDF描述
24LC256-E/P IC EEPROM 256KBIT 400KHZ 8DIP
AX500-2FGG484I IC FPGA AXCELERATOR 500K 484FBGA
A3PE3000-FG896 IC FPGA 1KB FLASH 3M 896-FBGA
A3PE3000-1FG324 IC FPGA 1KB FLASH 3M 324-FBGA
A3PE3000L-FGG324 IC FPGA 1KB FLASH 3M 324-FBGA
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
A3PE3000-FGG896ES 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:ProASIC3E Flash Family FPGAs
A3PE3000-FGG896I 功能描述:IC FPGA 1KB FLASH 3M 896-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:ProASIC3E 標(biāo)準(zhǔn)包裝:1 系列:ProASICPLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:129024 輸入/輸出數(shù):248 門數(shù):600000 電源電壓:2.3 V ~ 2.7 V 安裝類型:表面貼裝 工作溫度:- 封裝/外殼:352-BFCQFP,帶拉桿 供應(yīng)商設(shè)備封裝:352-CQFP(75x75)
A3PE3000-FGG896PP 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:ProASIC3E Flash Family FPGAs
A3PE3000-FPQ208 制造商:Microsemi Corporation 功能描述:FPGA PROASIC3E 3M GATES 193MHZ 130NM 1.5V 208PQFP - Trays
A3PE3000-FPQ896 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:ProASIC3E Flash Family FPGAs