CMOS Output Module Timing5 t" />
參數(shù)資料
型號(hào): A40MX04-2PLG84I
廠商: Microsemi SoC
文件頁數(shù): 103/142頁
文件大?。?/td> 0K
描述: IC FPGA MX SGL CHIP 6K 84-PLCC
標(biāo)準(zhǔn)包裝: 16
系列: MX
輸入/輸出數(shù): 69
門數(shù): 6000
電源電壓: 3 V ~ 3.6 V,4.5 V ~ 5.5 V
安裝類型: 表面貼裝
工作溫度: -40°C ~ 85°C
封裝/外殼: 84-LCC(J 形引線)
供應(yīng)商設(shè)備封裝: 84-PLCC(29.31x29.31)
40MX and 42MX FPGA Families
Re vi s i on 11
1 - 59
CMOS Output Module Timing5
tDLH
Data-to-Pad HIGH
3.4
3.8
5.5
6.4
9.0
ns
tDHL
Data-to-Pad LOW
4.1
4.5
4.2
5.0
7.0
ns
tENZH
Enable Pad Z to HIGH
3.7
4.1
4.6
5.5
7.6
ns
tENZL
Enable Pad Z to LOW
4.1
4.5
5.1
6.1
8.5
ns
tENHZ
Enable Pad HIGH to Z
6.9
7.6
8.6
10.2
14.2
ns
tENLZ
Enable Pad LOW to Z
7.5
8.3
9.4
11.1
15.5
ns
tGLH
G-to-Pad HIGH
5.8
6.5
7.3
8.6
12.0
ns
tGHL
G-to-Pad LOW
5.8
6.5
7.3
8.6
12.0
ns
tLSU
I/O Latch Set-Up
0.7
0.8
0.9
1.0
1.4
ns
tLH
I/O Latch Hold
0.0
ns
tLCO
I/O Latch Clock-to-Out
(Pad-to-Pad), 64 Clock Loading
8.7
9.7
10.9
12.9
18.0
ns
tACO
Array Clock-to-Out
(Pad-to-Pad),
64 Clock Loading
12.2
13.5
15.4
18.1
25.3
ns
dTLH
Capacity Loading, LOW to HIGH
0.04
0.05
0.06
0.08 ns/pF
dTHL
Capacity Loading, HIGH to LOW
0.05
0.06
0.07
0.10 ns/pF
Table 1-33 A42MX09 Timing Characteristics (Nominal 3.3 V Operation) (continued)
(Worst-Case Commercial Conditions, VCCA = 3.0 V, TJ = 70°C)
–3 Speed
–2 Speed
–1 Speed
Std Speed
–F Speed
Units
Parameter / Description
Min. Max. Min. Max. Min. Max. Min. Max. Min. Max.
Notes:
1. For dual-module macros, use tPD1 + tRD1 + tPDn, tCO + tRD1 + tPDn, or tPD1 + tRD1 + tSUD, whichever is appropriate.
2. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for
estimating device performance. Post-route timing analysis or simulation is required to determine actual performance.
3. Data applies to macros based on the S-module. Timing parameters for sequential macros constructed from C-modules
can be obtained from the Timer utility.
4. Set-up and hold timing parameters for the input buffer latch are defined with respect to the PAD and the D input. External
setup/hold timing parameters must account for delay from an external PAD signal to the G inputs. Delay from an external
PAD signal to the G input subtracts (adds) to the internal setup (hold) time.
5. Delays based on 35 pF loading.
相關(guān)PDF資料
PDF描述
GSC60DRAH CONN EDGECARD 120PS R/A .100 SLD
A40MX04-2PL84I IC FPGA MX SGL CHIP 6K 84-PLCC
GMC60DRAH CONN EDGECARD 120PS R/A .100 SLD
EP4CE15F23I8L IC CYCLONE IV FPGA 15K 484FBGA
HSC49DREF-S734 CONN EDGECARD 98POS .100 EYELET
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
A40MX04-2PQ100 功能描述:IC FPGA MX SGL CHIP 6K 100-PQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門陣列) 系列:MX 標(biāo)準(zhǔn)包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計(jì):36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應(yīng)商設(shè)備封裝:256-FPBGA(17x17)
A40MX04-2PQ100I 功能描述:IC FPGA MX SGL CHIP 6K 100-PQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門陣列) 系列:MX 標(biāo)準(zhǔn)包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計(jì):36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應(yīng)商設(shè)備封裝:256-FPBGA(17x17)
A40MX04-2PQ100M 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Field Programmable Gate Array (FPGA)
A40MX04-2PQG100 功能描述:IC FPGA MX SGL CHIP 6K 100-PQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門陣列) 系列:MX 標(biāo)準(zhǔn)包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計(jì):36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應(yīng)商設(shè)備封裝:256-FPBGA(17x17)
A40MX04-2PQG100I 功能描述:IC FPGA MX SGL CHIP 6K 100-PQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門陣列) 系列:MX 標(biāo)準(zhǔn)包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計(jì):36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應(yīng)商設(shè)備封裝:256-FPBGA(17x17)