參數(shù)資料
型號(hào)： A42MX24-1PQ100
廠商： Electronic Theatre Controls, Inc.
英文描述： 40MX and 42MX FPGA Families
中文描述： 40MX和42MX FPGA系列
文件頁(yè)數(shù)： 43/93頁(yè)
文件大?。?/td> 854K
代理商： A42MX24-1PQ100
48
Data Device Corporation
www.ddc-web.com
BU-6474X/6484X/6486X
J-07/05-0
THERMAL MANAGEMENT FOR MICRO-ACE-TE (324-
BALL BGA PACKAGE)
Ball Grid Array (BGA) components necessitate that thermal
management issues be considered early in the design stage for
MIL-STD-1553 terminals. This is especially true if high transmit-
ter duty cycles are expected. The temperature range specified for
DDC's Micro-ACE-TE device refers to the temperature at the
ball, not the case.
All Micro-ACE-TE devices incorporate multiple package connec-
tions which perform the dual function of transceiver circuit
ground and thermal heat sink. Refer to the pinout tables for ther-
mal ball connection locations. It is mandatory that these thermal
FIGURE 17. BALL LOCATIONS FOR MICRO-ACE-TE (324-BALL BGA PACKAGE)
balls be directly soldered to a circuit ground/thermal plane (a cir-
cuit trace is insufficient). Operation without an adequate
ground/thermal plane is not recommended and extended expo-
sure to these conditions may affect device reliability.
The purpose of this ground/thermal plane is to conduct the heat
being generated by the transceivers within the package and con-
duct this heat away from the Micro-ACE-TE. In general, the cir-
cuit ground and thermal (chassis) ground are not the same
ground plane. It is acceptable for these balls to be directly sol-
dered to a ground plane but it must be located in close physical
and thermal proximity ("0.003" pre-preg layer recommended) to
the thermal plane.
V U T R P N M L K J H G F E D C B A
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BOTTOM VIEW
S/N
D/C
TOP VIEW
ESD and Pin 1 Identifier
相關(guān)PDF資料
PDF描述
A42MX02-1PQ100A Audio Transformer; Power Rating:1W; Mounting Type:PCB Surface; External Depth:1.125"; External Height:1.125"; External Width:1.375"; Frequency Response Max:15kHz; Frequency Response Min:200Hz; Leaded Process Compatible:Yes
A42MX04-1PQ100A Line Matching Transformer; Leaded Process Compatible:Yes; Insertion Loss:0.8dBA; Peak Reflow Compatible (260 C):Yes
A42MX09-1PQ100A TRANSF 900 OHM SEC. 0MA DC TEL
A42MX16-1PQ100A 40MX and 42MX FPGA Families
A42MX24-1PQ100A TRANSF 4000 OHM PRI. 0MA DC TEL
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
A42MX24-1PQ160 功能描述:IC FPGA MX SGL CHIP 36K 160-PQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:MX 產(chǎn)品培訓(xùn)模塊:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色產(chǎn)品:Cyclone? IV FPGAs 標(biāo)準(zhǔn)包裝:60 系列:CYCLONE® IV GX LAB/CLB數(shù):9360 邏輯元件/單元數(shù):149760 RAM 位總計(jì):6635520 輸入/輸出數(shù):270 門數(shù):- 電源電壓:1.16 V ~ 1.24 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FBGA（23x23）
A42MX24-1PQ160I 功能描述:IC FPGA MX SGL CHIP 36K 160-PQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:MX 產(chǎn)品培訓(xùn)模塊:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色產(chǎn)品:Cyclone? IV FPGAs 標(biāo)準(zhǔn)包裝:60 系列:CYCLONE® IV GX LAB/CLB數(shù):9360 邏輯元件/單元數(shù):149760 RAM 位總計(jì):6635520 輸入/輸出數(shù):270 門數(shù):- 電源電壓:1.16 V ~ 1.24 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FBGA（23x23）
A42MX24-1PQ160M 制造商:Microsemi Corporation 功能描述:FPGA 36K GATES 912 CELLS 0.45UM 3.3V/5V 160PQFP - Trays 制造商:Microsemi Corporation 功能描述:IC FPGA MX SGL CHIP 36K 160-PQFP 制造商:Microsemi Corporation 功能描述:IC FPGA 125 I/O 160PQFP
A42MX24-1PQ208 功能描述:IC FPGA MX SGL CHIP 36K 208-PQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:MX 產(chǎn)品培訓(xùn)模塊:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色產(chǎn)品:Cyclone? IV FPGAs 標(biāo)準(zhǔn)包裝:60 系列:CYCLONE® IV GX LAB/CLB數(shù):9360 邏輯元件/單元數(shù):149760 RAM 位總計(jì):6635520 輸入/輸出數(shù):270 門數(shù):- 電源電壓:1.16 V ~ 1.24 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FBGA（23x23）
A42MX24-1PQ208I 功能描述:IC FPGA MX SGL CHIP 36K 208-PQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:MX 產(chǎn)品培訓(xùn)模塊:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色產(chǎn)品:Cyclone? IV FPGAs 標(biāo)準(zhǔn)包裝:60 系列:CYCLONE® IV GX LAB/CLB數(shù):9360 邏輯元件/單元數(shù):149760 RAM 位總計(jì):6635520 輸入/輸出數(shù):270 門數(shù):- 電源電壓:1.16 V ~ 1.24 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FBGA（23x23）
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