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參數(shù)資料
| 型號： | A42MX24-3VQ100A |
| 廠商： | Electronic Theatre Controls, Inc. |
| 英文描述： | 40MX and 42MX FPGA Families |
| 中文描述： | 40MX和42MX FPGA系列 |
| 文件頁數(shù)： | 37/93頁 |
| 文件大小： | 854K |
| 代理商： | A42MX24-3VQ100A |
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42
Data Device Corporation
www.ddc-web.com
BU-6474X/6484X/6486X
J-07/05-0
CLOCK IN
t1
t6
t7
t2
t3
t18
t16
VALID
t8
t9
t14
t15
t17
VALID
t12
t10
t4
t11
t5
VALID
t13
SELECT
(Note 2,7)
(Note 2)
(Note 3,4,7)
(Note 4,5)
STRBD
MEM/REG
RD/WR
IOEN
(Note 2,6)
(Note 6)
(Note 9,10)
(Note 7,8,9,10)
READYD
A15-A0
D15-D0
FIGURE 14. CPU WRITING RAM / REGISTER (16-BIT BUFFERED, NONZERO WAIT)
NOTES:
1.
For the 16-bit buffered nonzero wait configuration TRANSPARENT/BUFFERED must be connected to logic "0", ZERO_WAIT and DTREG / 16/8
must be connected to logic "1". The inputs TRIGGER_SEL and MSB/LSB may be connected to either Vcc or ground.
2.
SELECT and STRBD may be tied together. IOEN goes low on the first rising CLK edge when SELECT STRBD is sampled low (satisfying t1)
and the Mark3’s protocol/memory management logic is not accessing the internal RAM. When this occurs, IOEN goes low, starting the transfer
cycle. After IOEN goes low, SELECT may be released high.
3.
MEM/REG must be presented high for memory access, low for register access.
4.
MEM/REG and RD/WR are buffered transparently until the first falling edge of CLK after IOEN goes low. After this CLK edge, MEM/REG and
RD/WR become latched internally.
5.
The logic sense for RD/WR in the diagram assumes that POLARITY_SEL is connected to logic "1". If POLARITY_SEL is connected to logic "0",
RD/WR must be asserted high to write.
6.
The timing for the IOEN and READYD outputs assume a 50 pf load. For loading above 50 pf, the validity of IOEN and READYD is delayed by an
additional 0.14 ns/pf typ, 0.28 ns/pf max.
7.
The timing for A15-A0, MEM/REG, and SELECT assumes that ADDR-LAT is connected to logic "1". Refer to Address Latch timing for additional
details.
8.
The address bus A15-A0 and data bus D15-D0 are internally buffered transparently until the first rising edge of CLK after IOEN goes low. After
this CLK edge, A15-A0 and D15-D0 become latched internally.
9.
Setup time given for use in worst case timing calculations. None of the Mark3’s input signals are required to be synchronized to the system clock.
When SELECT and STRBD do not meet the setup time of t1, but occur during the setup time of an internal flip-flop, an additional clock cycle may
be inserted between the falling clock edge that latches MEM/REG and RD/WR and the rising clock edge that latches the address (A15-A0) and
data (D15-D0). When this occurs, the delay from IOEN falling to READYD falling (t14) increases by one clock cycle and the address and data hold
time (t12 and t13) must be increased by one clock.
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相關代理商/技術參數(shù) |
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| A42MX24-FPL84 | 功能描述:IC FPGA MX SGL CHIP 36K 84-PLCC RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:MX 標準包裝:40 系列:SX-A LAB/CLB數(shù):6036 邏輯元件/單元數(shù):- RAM 位總計:- 輸入/輸出數(shù):360 門數(shù):108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應商設備封裝:484-FPBGA（27X27） |
| A42MX24-FPLG84 | 功能描述:IC FPGA MX SGL CHIP 36K 84-PLCC RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:MX 標準包裝:40 系列:SX-A LAB/CLB數(shù):6036 邏輯元件/單元數(shù):- RAM 位總計:- 輸入/輸出數(shù):360 門數(shù):108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應商設備封裝:484-FPBGA（27X27） |
| A42MX24-FPQ160 | 功能描述:IC FPGA MX SGL CHIP 36K 160-PQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:MX 標準包裝:40 系列:SX-A LAB/CLB數(shù):6036 邏輯元件/單元數(shù):- RAM 位總計:- 輸入/輸出數(shù):360 門數(shù):108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應商設備封裝:484-FPBGA（27X27） |
| A42MX24-FPQ208 | 功能描述:IC FPGA MX SGL CHIP 36K 160-PQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:MX 標準包裝:40 系列:SX-A LAB/CLB數(shù):6036 邏輯元件/單元數(shù):- RAM 位總計:- 輸入/輸出數(shù):360 門數(shù):108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應商設備封裝:484-FPBGA（27X27） |
| A42MX24-FPQG160 | 功能描述:IC FPGA MX SGL CHIP 36K 160-PQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:MX 標準包裝:40 系列:SX-A LAB/CLB數(shù):6036 邏輯元件/單元數(shù):- RAM 位總計:- 輸入/輸出數(shù):360 門數(shù):108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應商設備封裝:484-FPBGA（27X27） |
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