參數(shù)資料
型號： A42MX36-BG272A
元件分類： FPGA
英文描述： FPGA, 54000 GATES, PBGA272
封裝： PLASTIC, BGA-272
文件頁數(shù)： 27/76頁
文件大?。?/td> 429K
代理商： A42MX36-BG272A
MX Automotive Family FPGAs
v2.0
1-27
Table 1-6 A40MX04 Timing Characteristics (Nominal 5.0V Operation)
Worst-Case Automotive Conditions, VCC = 4.75V, TJ = 125°C
‘Std’ Speed
Parameter
Description
Min.
Max.
Units
Logic Module Propagation Delays
tPD1
Single Module
2.3
ns
tPD2
Dual-Module Macros
5.0
ns
tCO
Sequential Clock-to-Q
2.3
ns
tGO
Latch G-to-Q
2.3
ns
tRS
Flip-Flop (Latch) Reset-to-Q
2.3
ns
Logic Module Predicted Routing Delays1
tRD1
FO=1 Routing Delay
2.6
ns
tRD2
FO=2 Routing Delay
3.6
ns
tRD3
FO=3 Routing Delay
4.5
ns
tRD4
FO=4 Routing Delay
5.5
ns
tRD8
FO=8 Routing Delay
9.5
ns
Logic Module Sequential Timing2
tSUD
Flip-Flop (Latch) Data Input Set-Up
5.8
ns
tHD
3
Flip-Flop (Latch) Data Input Hold
0.0
ns
tSUENA
Flip-Flop (Latch) Enable Set-Up
5.8
ns
tHENA
Flip-Flop (Latch) Enable Hold
0.0
ns
tWCLKA
Flip-Flop (Latch) Clock Active Pulse Width
6.1
ns
tWASYN
Flip-Flop (Latch) Asynchronous Pulse Width
6.2
ns
tA
Flip-Flop Clock Input Period
9.2
ns
fMAX
Flip-Flop (Latch) Clock Frequency
(FO = 128)
164
MHz
Input Module Propagation Delays
tINYH
Pad-to-Y HIGH
1.4
ns
tINYL
Pad-to-Y LOW
1.2
ns
Input Module Predicted Routing Delays1
tIRD1
FO=1 Routing Delay
3.9
ns
tIRD2
FO=2 Routing Delay
4.9
ns
tIRD3
FO=3 Routing Delay
5.9
ns
tIRD4
FO=4 Routing Delay
6.9
ns
tIRD8
FO=8 Routing Delay
10.7
ns
1. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating
device performance. Post-route timing analysis or simulation is required to determine actual performance.
2. Set-up times assume fanout of 3. Further testing information can be obtained from the Timer utility.
3. The hold time for the DFME1A macro may be greater than 0 ns. Use the Series or later Timer to check the hold time for this macro.
4. Delays based on 35 pF loading.
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
A42MX36-BG272I 功能描述:IC FPGA MX SGL CHIP 54K 272-PBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:MX 標準包裝:1 系列:ProASICPLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:129024 輸入/輸出數(shù):248 門數(shù):600000 電源電壓:2.3 V ~ 2.7 V 安裝類型:表面貼裝 工作溫度:- 封裝/外殼:352-BFCQFP，帶拉桿 供應(yīng)商設(shè)備封裝:352-CQFP（75x75）
A42MX36-BG272M 制造商:Microsemi Corporation 功能描述:FPGA 42MX Family 54K Gates 1184 Cells 79MHz/131MHz 0.45um Technology 3.3V/5V 272-Pin BGA 制造商:Microsemi Corporation 功能描述:FPGA 54K GATES 1184 CELLS 79MHZ/131MHZ 0.45UM 3.3V/5V 272BGA - Trays 制造商:Microsemi Corporation 功能描述:IC FPGA 202 I/O 272PBGA 制造商:Microsemi Corporation 功能描述:IC FPGA MX SGL CHIP 54K 272-PBGA
A42MX36-BGG272 功能描述:IC FPGA MX SGL CHIP 54K 272-PBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:MX 產(chǎn)品培訓(xùn)模塊:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色產(chǎn)品:Cyclone? IV FPGAs 標準包裝:60 系列:CYCLONE® IV GX LAB/CLB數(shù):9360 邏輯元件/單元數(shù):149760 RAM 位總計:6635520 輸入/輸出數(shù):270 門數(shù):- 電源電壓:1.16 V ~ 1.24 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FBGA（23x23）
A42MX36-BGG272I 功能描述:IC FPGA MX SGL CHIP 54K 272-PBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:MX 標準包裝:1 系列:ProASICPLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:129024 輸入/輸出數(shù):248 門數(shù):600000 電源電壓:2.3 V ~ 2.7 V 安裝類型:表面貼裝 工作溫度:- 封裝/外殼:352-BFCQFP，帶拉桿 供應(yīng)商設(shè)備封裝:352-CQFP（75x75）
A42MX36-BGG272M 制造商:Microsemi Corporation 功能描述:FPGA 42MX Family 54K Gates 1184 Cells 79MHz/131MHz 0.45um Technology 3.3V/5V 272-Pin BGA 制造商:Microsemi Corporation 功能描述:FPGA 54K GATES 1184 CELLS 79MHZ/131MHZ 0.45UM 3.3V/5V 272BGA - Trays 制造商:Microsemi Corporation 功能描述:IC FPGA 202 I/O 272PBGA
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