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參數(shù)資料
| 型號： | A42MX36-FBG272 |
| 廠商： | Microsemi SoC |
| 文件頁數(shù)： | 100/142頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC FPGA MX SGL CHIP 54K 272-PBGA |
| 標(biāo)準(zhǔn)包裝： | 40 |
| 系列： | MX |
| RAM 位總計： | 2560 |
| 輸入/輸出數(shù)： | 202 |
| 門數(shù)： | 54000 |
| 電源電壓： | 3 V ~ 3.6 V，4.75 V ~ 5.25 V |
| 安裝類型： | 表面貼裝 |
| 工作溫度： | 0°C ~ 70°C |
| 封裝/外殼： | 272-BBGA |
| 供應(yīng)商設(shè)備封裝： | 272-PBGA（27x27） |
40MX and 42MX FPGA Families
1- 56
R e v i sio n 1 1
Table 1-33 A42MX09 Timing Characteristics (Nominal 3.3 V Operation)
(Worst-Case Commercial Conditions, VCCA = 3.0 V, TJ = 70°C)
–3 Speed
–2 Speed
–1 Speed
Std Speed
–F Speed
Units
Parameter / Description
Min. Max. Min. Max. Min. Max. Min. Max. Min. Max.
Logic Module Propagation Delays1
tPD1
Single Module
1.6
1.8
2.1
2.5
3.5
ns
tCO
Sequential Clock-to-Q
1.8
2.0
2.3
2.7
3.8
ns
tGO
Latch G-to-Q
1.7
1.9
2.1
2.5
3.5
ns
tRS
Flip-Flop (Latch) Reset-to-Q
2.0
2.2
2.5
2.9
4.1
ns
Logic Module Predicted Routing Delays2
tRD1
FO = 1 Routing Delay
1.0
1.1
1.2
1.4
2.0
ns
tRD2
FO = 2 Routing Delay
1.3
1.4
1.6
1.9
2.7
ns
tRD3
FO = 3 Routing Delay
1.6
1.8
2.0
2.4
3.3
ns
tRD4
FO = 4 Routing Delay
1.9
2.1
2.4
2.9
4.0
ns
tRD8
FO = 8 Routing Delay
3.2
3.6
4.1
4.8
6.7
ns
Logic Module Sequential Timing 3, 4
tSUD
Flip-Flop (Latch) Data Input Set-Up 0.5
0.5
0.6
0.7
0.9
ns
tHD
Flip-Flop (Latch) Data Input Hold
0.0
ns
tSUENA
Flip-Flop (Latch) Enable Set-Up
0.6
0.7
0.8
1.2
ns
tHENA
Flip-Flop (Latch) Enable Hold
0.0
ns
tWCLKA
Flip-Flop (Latch)
Clock Active Pulse Width
4.7
5.3
6.0
7.0
9.8
ns
tWASYN
Flip-Flop (Latch)
Asynchronous Pulse Width
6.2
6.9
7.8
9.2
12.9
ns
tA
Flip-Flop Clock Input Period
5.0
5.6
6.2
7.1
9.9
ns
tINH
Input Buffer Latch Hold
0.0
ns
tINSU
Input Buffer Latch Set-Up
0.3
0.4
0.6
ns
tOUTH
Output Buffer Latch Hold
0.0
ns
tOUTSU
Output Buffer Latch Set-Up
0.3
0.4
0.6
ns
fMAX
Flip-Flop (Latch) Clock Frequency
161
146
135
117
70
MHz
Notes:
1. For dual-module macros, use tPD1 + tRD1 + tPDn, tCO + tRD1 + tPDn, or tPD1 + tRD1 + tSUD, whichever is appropriate.
2. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for
estimating device performance. Post-route timing analysis or simulation is required to determine actual performance.
3. Data applies to macros based on the S-module. Timing parameters for sequential macros constructed from C-modules
can be obtained from the Timer utility.
4. Set-up and hold timing parameters for the input buffer latch are defined with respect to the PAD and the D input. External
setup/hold timing parameters must account for delay from an external PAD signal to the G inputs. Delay from an external
PAD signal to the G input subtracts (adds) to the internal setup (hold) time.
5. Delays based on 35 pF loading.
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| A42MX36-FBGG272 | 功能描述:IC FPGA MX SGL CHIP 54K 272-PBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:MX 產(chǎn)品培訓(xùn)模塊:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色產(chǎn)品:Cyclone? IV FPGAs 標(biāo)準(zhǔn)包裝:60 系列:CYCLONE® IV GX LAB/CLB數(shù):9360 邏輯元件/單元數(shù):149760 RAM 位總計:6635520 輸入/輸出數(shù):270 門數(shù):- 電源電壓:1.16 V ~ 1.24 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FBGA（23x23） |
| A42MX36-FPQ208 | 功能描述:IC FPGA MX SGL CHIP 54K 208-PQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:MX 產(chǎn)品培訓(xùn)模塊:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色產(chǎn)品:Cyclone? IV FPGAs 標(biāo)準(zhǔn)包裝:60 系列:CYCLONE® IV GX LAB/CLB數(shù):9360 邏輯元件/單元數(shù):149760 RAM 位總計:6635520 輸入/輸出數(shù):270 門數(shù):- 電源電壓:1.16 V ~ 1.24 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FBGA（23x23） |
| A42MX36-FPQ240 | 功能描述:IC FPGA MX SGL CHIP 54K 240-PQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:MX 產(chǎn)品培訓(xùn)模塊:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色產(chǎn)品:Cyclone? IV FPGAs 標(biāo)準(zhǔn)包裝:60 系列:CYCLONE® IV GX LAB/CLB數(shù):9360 邏輯元件/單元數(shù):149760 RAM 位總計:6635520 輸入/輸出數(shù):270 門數(shù):- 電源電壓:1.16 V ~ 1.24 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FBGA（23x23） |
| A42MX36-FPQG208 | 功能描述:IC FPGA MX SGL CHIP 54K 208-PQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:MX 產(chǎn)品培訓(xùn)模塊:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色產(chǎn)品:Cyclone? IV FPGAs 標(biāo)準(zhǔn)包裝:60 系列:CYCLONE® IV GX LAB/CLB數(shù):9360 邏輯元件/單元數(shù):149760 RAM 位總計:6635520 輸入/輸出數(shù):270 門數(shù):- 電源電壓:1.16 V ~ 1.24 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FBGA（23x23） |
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