![](http://datasheet.mmic.net.cn/240000/A54SX16-CQ256B_datasheet_15643070/A54SX16-CQ256B_12.png)
54SX Family FPGAs RadTolerant and HiRel
12
v2.0
Power-Up Sequencing
RT54SX16, A54SX16, RT54SX32, A54SX32
Power-Down Sequencing
RT54SX16, A54SX16, RT54SX32, A54SX32
Package Thermal Characteristics
The device junction to case thermal characteristic is
θ
jc
,
and the junction to ambient air characteristic is
θ
ja
. The
thermal characteristics for
θ
ja
are shown with two different
air flow rates.
Maximum junction temperature is 150
°
C.
A sample calculation of the absolute maximum power
dissipation allowed for an RT54SX16 in a CQFP 256-pin
package at military temperature and still air is as follows:
V
CCA
V
CCR
V
CCI
Power-Up Sequence
Comments
3.3V
5.0V
3.3V
5.0V First
3.3V Second
No possible damage to device.
3.3V First
5.0V Second
Possible damage to device.
V
CCA
V
CCR
V
CCI
Power-Down Sequence
Comments
3.3V
5.0V
3.3V
5.0V First
3.3V Second
Possible damage to device.
3.3V First
5.0V Second
No possible damage to device.
Package Type
Pin Count
θ
jc
θ
ja
Still Air
Units
RT54SX16
Ceramic Quad Flat Pack (CQFP)
208
7.5
29
°
C/W
°
C/W
Ceramic Quad Flat Pack (CQFP)
256
4.6
23
RT54SX32
Ceramic Quad Flat Pack (CQFP)
208
6.9
35
°
C/W
°
C/W
Ceramic Quad Flat Pack (CQFP)
256
3.5
20
A54SX16
Ceramic Quad Flat Pack (CQFP)
208
7.9
30
°
C/W
°
C/W
Ceramic Quad Flat Pack (CQFP)
256
5.6
25
A54SX32
Ceramic Quad Flat Pack (CQFP)
208
7.6
30
°
C/W
°
C/W
Ceramic Quad Flat Pack (CQFP)
256
4.8
24
Absolute Maximum Power Allowed
ja
(°C/W)
Max. junction temp. (°C) – Max. ambient temp. (°C)
23°C/W
150°C – 125°C
1.09W
=
=
=