參數(shù)資料
型號(hào)： A54SX16A-TQ144A
廠商： Microsemi SoC
文件頁(yè)數(shù)： 13/108頁(yè)
文件大?。?/td> 0K
描述： IC FPGA SX 24K GATES 144-TQFP
標(biāo)準(zhǔn)包裝： 60
系列： SX-A
LAB/CLB數(shù)： 1452
輸入/輸出數(shù)： 113
門(mén)數(shù)： 24000
電源電壓： 2.25 V ~ 5.25 V
安裝類(lèi)型： 表面貼裝
工作溫度： -40°C ~ 125°C
封裝/外殼： 144-LQFP
供應(yīng)商設(shè)備封裝： 144-TQFP（20x20）
SX-A Family FPGAs
1- 8
v5.3
Power-Up/Down and Hot Swapping
SX-A I/Os are configured to be hot-swappable, with the
exception of 3.3 V PCI. During power-up/down (or partial
up/down), all I/Os are tristated. VCCA and VCCI do not
have to be stable during power-up/down, and can be
powered up/down in any order. When the SX-A device is
plugged into an electrically active system, the device will
not degrade the reliability of or cause damage to the
host system. The device’s output pins are driven to a high
impedance state until normal chip operating conditions
are reached. Table 1-4 summarizes the VCCA voltage at
which the I/Os behave according to the user’s design for
an SX-A device at room temperature for various ramp-up
rates. The data reported assumes a linear ramp-up
profile to 2.5 V. For more information on power-up and
hot-swapping, refer to the application note, Actel SX-A
Table 1-2 I/O Features
Function
Description
Input Buffer Threshold Selections
5 V: PCI, TTL
3.3 V: PCI, LVTTL
2.5 V: LVCMOS2 (commercial only)
Flexible Output Driver
5 V: PCI, TTL
3.3 V: PCI, LVTTL
2.5 V: LVCMOS2 (commercial only)
Output Buffer
“Hot-Swap” Capability (3.3 V PCI is not hot swappable)
I/O on an unpowered device does not sink current
Can be used for “cold-sparing”
Selectable on an individual I/O basis
Individually selectable slew rate; high slew or low slew (The default is high slew rate).
The slew is only affected on the falling edge of an output. Rising edges of outputs are
not affected.
Power-Up
Individually selectable pull-ups and pull-downs during power-up (default is to power-up
in tristate)
Enables deterministic power-up of device
VCCA and VCCI can be powered in any order
Table 1-3 I/O Characteristics for All I/O Configurations
Hot Swappable
Slew Rate Control
Power-Up Resistor
TTL, LVTTL, LVCMOS2
Yes
Yes. Only affects falling edges of outputs
Pull-up or pull-down
3.3 V PCI
No
No. High slew rate only
Pull-up or pull-down
5 V PCI
Yes
No. High slew rate only
Pull-up or pull-down
Table 1-4 Power-Up Time at which I/Os Become Active
Supply Ramp Rate
0.25 V/
μs 0.025 V/μs
5 V/ms
2.5 V/ms
0.5 V/ms
0.25 V/ms
0.1 V/ms
0.025 V/ms
Units
μs
ms
msms
ms
A54SX08A
10
96
0.34
0.65
2.7
5.4
12.9
50.8
A54SX16A
10
100
0.36
0.62
2.5
4.7
11.0
41.6
A54SX32A
10
100
0.46
0.74
2.8
5.2
12.1
47.2
A54SX72A
10
100
0.41
0.67
2.6
5.0
12.1
47.2
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參數(shù)描述
A54SX16A-TQ144I 功能描述:IC FPGA SX 24K GATES 144-TQFP RoHS:否 類(lèi)別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門(mén)陣列） 系列:SX-A 標(biāo)準(zhǔn)包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計(jì):36864 輸入/輸出數(shù):157 門(mén)數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類(lèi)型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應(yīng)商設(shè)備封裝:256-FPBGA（17x17）
A54SX16A-TQ144IPT70 制造商:Microsemi SOC Products Group 功能描述:ACLA54SX16A-TQ144IPT70 227MHZ 0.25UM/0.2
A54SX16A-TQ144M 制造商:Microsemi Corporation 功能描述:FPGA SX-A Family 16K Gates 924 Cells 227MHz 0.25um/0.22um (CMOS) Technology 2.5V 144-Pin TQFP 制造商:Microsemi Corporation 功能描述:FPGA SX-A 16K GATES 924 CELLS 227MHZ 0.25UM/0.22UM 2.5V 144T - Trays 制造商:Microsemi Corporation 功能描述:IC FPGA 113 I/O 144TQFP 制造商:Microsemi Corporation 功能描述:IC FPGA 24K GATES 144TQFP
A54SX16A-TQG100 功能描述:IC FPGA 180I/O 100TQFP RoHS:是 類(lèi)別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門(mén)陣列） 系列:SX-A 標(biāo)準(zhǔn)包裝:24 系列:ECP2 LAB/CLB數(shù):1500 邏輯元件/單元數(shù):12000 RAM 位總計(jì):226304 輸入/輸出數(shù):131 門(mén)數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類(lèi)型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:208-BFQFP 供應(yīng)商設(shè)備封裝:208-PQFP（28x28）
A54SX16A-TQG100A 功能描述:IC FPGA SX 24K GATES 100-TQFP RoHS:是 類(lèi)別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門(mén)陣列） 系列:SX-A 標(biāo)準(zhǔn)包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計(jì):36864 輸入/輸出數(shù):157 門(mén)數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類(lèi)型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應(yīng)商設(shè)備封裝:256-FPBGA（17x17）
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