參數(shù)資料
型號(hào): A54SX32A-1CQ208B
廠商: Microsemi SoC
文件頁(yè)數(shù): 34/108頁(yè)
文件大?。?/td> 0K
描述: IC FPGA SX 48K GATES 208-CQFP
標(biāo)準(zhǔn)包裝: 1
系列: SX-A
LAB/CLB數(shù): 2880
輸入/輸出數(shù): 174
門(mén)數(shù): 48000
電源電壓: 2.25 V ~ 5.25 V
安裝類(lèi)型: 表面貼裝
封裝/外殼: 208-BFCQFP,帶拉桿
供應(yīng)商設(shè)備封裝: 208-CQFP(75x75)
SX-A Family FPGAs
v5.3
2-11
Thermal Characteristics
Introduction
The temperature variable in Actel Designer software refers to the junction temperature, not the ambient, case, or
board temperatures. This is an important distinction because dynamic and static power consumption will cause the
chip's junction to be higher than the ambient, case, or board temperatures. EQ 2-9 and EQ 2-10 give the relationship
between thermal resistance, temperature gradient and power.
EQ 2-9
EQ 2-10
Where:
θ
JA
T
J
T
A
P
----------------
=
θ
JA
T
C
T
A
P
------------------
=
θ
JA = Junction-to-air thermal resistance
θ
JC = Junction-to-case thermal resistance
TJ
= Junction temperature
TA = Ambient temperature
TC = Ambient temperature
P
= total power dissipated by the device
Table 2-12 Package Thermal Characteristics
Package Type
Pin
Count
θ
JC
θ
JA
Units
Still Air
1.0 m/s
200 ft./min.
2.5 m/s
500 ft./min.
Thin Quad Flat Pack (TQFP)
100
14
33.5
27.4
25
°C/W
Thin Quad Flat Pack (TQFP)
144
11
33.5
28
25.7
°C/W
Thin Quad Flat Pack (TQFP)
176
11
24.7
19.9
18
°C/W
Plastic Quad Flat Pack (PQFP)1
208
8
26.1
22.5
20.8
°C/W
Plastic Quad Flat Pack (PQFP) with Heat Spreader2
208
3.8
16.2
13.3
11.9
°C/W
Plastic Ball Grid Array (PBGA)
329
3
17.1
13.8
12.8
°C/W
Fine Pitch Ball Grid Array (FBGA)
144
3.8
26.9
22.9
21.5
°C/W
Fine Pitch Ball Grid Array (FBGA)
256
3.8
26.6
22.8
21.5
°C/W
Fine Pitch Ball Grid Array (FBGA)
484
3.2
18
14.7
13.6
°C/W
Notes:
1. The A54SX08A PQ208 has no heat spreader.
2. The SX-A PQ208 package has a heat spreader for A54SX16A, A54SX32A, and A54SX72A.
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