參數資料
型號: A54SX32AFG256
英文描述: Logic IC
中文描述: 邏輯IC
文件頁數: 24/36頁
文件大?。?/td> 833K
代理商: A54SX32AFG256
54SX Family FPGAs RadTolerant and HiRel
24
v2.0
RT54SX32 Timing Characteristics
(Worst-Case Military Conditions, V
CCR
= 4.75V, V
CCA,
V
CCI
= 3.0V, T
J
= 125
°
C)
C-Cell Propagation Delays
1
‘–
1
Speed
Std
Speed
Parameter
Description
Min.
Max.
Min.
Max.
Units
t
PD
Predicted Routing Delays
2
Internal Array Module
1.7
1.8
ns
t
DC
t
FC
t
RD1
t
RD2
t
RD3
t
RD4
t
RD8
t
RD12
t
RD18
t
RD24
FO=1 Routing Delay, Direct Connect
0.2
0.2
ns
FO=1 Routing Delay, Fast Connect
1.1
1.3
ns
FO=1 Routing Delay
1.3
1.5
ns
FO=2 Routing Delay
2.2
2.6
ns
FO=3 Routing Delay
3.1
3.6
ns
FO=4 Routing Delay
4.0
4.7
ns
FO=8 Routing Delay
7.8
9.0
ns
FO=12 Routing Delay
10.1
11.9
ns
FO=18 Routing Delay
17.0
19.8
ns
FO=24 Routing Delay
22.4
26.3
ns
R-Cell Timing
t
RCO
t
CLR
t
SUD
t
HD
t
WASYN
Sequential Clock-to-Q
1.5
2.0
ns
Asynchronous Clear-to-Q
1.5
2.0
ns
Flip-Flop Data Input Set-Up
2.0
2.2
ns
Flip-Flop Data Input Hold
0.0
0.0
ns
Asynchronous Pulse Width
4.4
5.3
ns
I/O Module Input Propagation Delays
t
INYH
t
INYL
Predicted Input Routing Delays
3
Input Data Pad-to-Y HIGH
4.0
4.7
ns
Input Data Pad-to-Y LOW
4.0
4.7
ns
t
IRD1
t
IRD2
t
IRD3
t
IRD4
t
IRD8
t
IRD12
t
IRD18
t
IRD24
Notes:
1.
2.
FO=1 Routing Delay
1.3
1.5
ns
FO=2 Routing Delay
2.2
2.6
ns
FO=3 Routing Delay
3.1
3.6
ns
FO=4 Routing Delay
4.0
4.7
ns
FO=8 Routing Delay
7.8
9.0
ns
FO=12 Routing Delay
10.1
11.9
ns
FO=18 Routing Delay
17.0
19.8
ns
FO=24 Routing Delay
22.4
26.3
ns
For dual-module macros, use t
PD
+ t
RD1
+ t
PDn
, t
RCO
+ t
RD1
+ t
PDn
or t
PD1
+ t
RD1
+ t
SUD
, whichever is appropriate.
Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating device
performance. Post-route timing analysis or simulation is required to determine actual worst-case performance. Post-route timing is
based on actual routing delay measurements performed on the device prior to shipment.
Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating device
performance. Post-route timing analysis or simulation is required to determine actual worst-case performance. Post-route timing is
based on actual routing delay measurements performed on the device prior to shipment.
3.
相關PDF資料
PDF描述
A54SX32AFG256I Logic IC
A54SX32AFG256M Logic IC
A54SX32-BG313 Field Programmable Gate Array (FPGA)
A54SX32-BG313I Field Programmable Gate Array (FPGA)
A54SX32-BG313M Field Programmable Gate Array (FPGA)
相關代理商/技術參數
參數描述
A54SX32A-FG256 功能描述:IC FPGA SX 48K GATES 256-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現場可編程門陣列) 系列:SX-A 標準包裝:40 系列:SX-A LAB/CLB數:6036 邏輯元件/單元數:- RAM 位總計:- 輸入/輸出數:360 門數:108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應商設備封裝:484-FPBGA(27X27)
A54SX32A-FG256A 功能描述:IC FPGA SX 48K GATES 256-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現場可編程門陣列) 系列:SX-A 標準包裝:40 系列:SX-A LAB/CLB數:6036 邏輯元件/單元數:- RAM 位總計:- 輸入/輸出數:360 門數:108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應商設備封裝:484-FPBGA(27X27)
A54SX32A-FG256I 功能描述:IC FPGA SX 48K GATES 256-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現場可編程門陣列) 系列:SX-A 標準包裝:40 系列:SX-A LAB/CLB數:6036 邏輯元件/單元數:- RAM 位總計:- 輸入/輸出數:360 門數:108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應商設備封裝:484-FPBGA(27X27)
A54SX32A-FG256M 制造商:Microsemi Corporation 功能描述:FPGA SX-A 32K GATES 1800 CELLS 238MHZ 0.25UM/0.22UM 2.5V 256 - Trays 制造商:Microsemi Corporation 功能描述:IC FPGA 48K GATES 256FBGA 制造商:Microsemi Corporation 功能描述:IC FPGA 203 I/O 256FBGA
A54SX32A-FG484 功能描述:IC FPGA SX 48K GATES 484-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現場可編程門陣列) 系列:SX-A 標準包裝:40 系列:SX-A LAB/CLB數:6036 邏輯元件/單元數:- RAM 位總計:- 輸入/輸出數:360 門數:108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應商設備封裝:484-FPBGA(27X27)