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參數(shù)資料
| 型號： | A54SX72A-PQG208I |
| 廠商： | Microsemi SoC |
| 文件頁數(shù)： | 30/108頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC FPGA SX-A 108K 208-PQFP |
| 標準包裝： | 24 |
| 系列： | SX-A |
| LAB/CLB數(shù)： | 6036 |
| 輸入/輸出數(shù)： | 171 |
| 門數(shù)： | 108000 |
| 電源電壓： | 2.25 V ~ 5.25 V |
| 安裝類型： | 表面貼裝 |
| 工作溫度： | -40°C ~ 85°C |
| 封裝/外殼： | 208-BFQFP |
| 供應商設備封裝： | 208-PQFP（28x28） |
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SX-A Family FPGAs
2- 8
v5.3
Power Dissipation
A critical element of system reliability is the ability of electronic devices to safely dissipate the heat generated during
operation. The thermal characteristics of a circuit depend on the device and package used, the operating temperature,
the operating current, and the system's ability to dissipate heat.
A complete power evaluation should be performed early in the design process to help identify potential heat-related
problems in the system and to prevent the system from exceeding the device’s maximum allowed junction
temperature.
The actual power dissipated by most applications is significantly lower than the power the package can dissipate.
However, a thermal analysis should be performed for all projects. To perform a power evaluation, follow these steps:
1. Estimate the power consumption of the application.
2. Calculate the maximum power allowed for the device and package.
3. Compare the estimated power and maximum power values.
Estimating Power Dissipation
The total power dissipation for the SX-A family is the sum of the DC power dissipation and the AC power dissipation:
PTotal = PDC + PAC
EQ 2-5
DC Power Dissipation
The power due to standby current is typically a small component of the overall power. An estimation of DC power
dissipation under typical conditions is given by:
PDC = IStandby * VCCA
EQ 2-6
Note: For other combinations of temperature and voltage settings, refer to the eX, SX-A and RT54SX-S Power
AC Power Dissipation
The power dissipation of the SX-A family is usually dominated by the dynamic power dissipation. Dynamic power
dissipation is a function of frequency, equivalent capacitance, and power supply voltage. The AC power dissipation is
defined as follows:
PAC = PC-cells + PR-cells + PCLKA + PCLKB + PHCLK + POutput Buffer + PInput Buffer
EQ 2-7
or:
EQ 2-8
PAC =
VCCA
2 * [(m * C
EQCM * fm)C-cells + (m * CEQSM * fm)R-cells + (n * CEQI * fn)Input Buffer + (p * (CEQO + CL) * fp)Output Buffer
+ (0.5 * (q1 * CEQCR * fq1) + (r1 * fq1))CLKA + (0.5 * (q2 * CEQCR * fq2)+ (r2 * fq2))CLKB + (0.5 * (s1 * CEQHV * fs1) +
(CEQHF * fs1))HCLK]
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相關代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| A54SX72A-PQG208M | 制造商:Microsemi Corporation 功能描述:FPGA SX-A Family 72K Gates 4024 Cells 217MHz 0.25um Technology 2.5V 208-Pin PQFP 制造商:Microsemi Corporation 功能描述:FPGA SX-A 72K GATES 4024 CELLS 217MHZ 0.25UM/0.22UM 2.5V 208 - Trays |
| A54SX72A-PQG208X3 | 制造商:Microsemi Corporation 功能描述:SX-A 72K GATE 4024 MC 217MHZ COMM ANTIFUSE 2.5/3.3/5V 208QFP - Trays |
| A55 | 制造商:M/A-COM Technology Solutions 功能描述:GAIN BLOCK |
| A5-5 | 制造商:MA-COM 制造商全稱:M/A-COM Technology Solutions, Inc. 功能描述:Cascadable Amplifier 5 to 500 MHz |
| A550 | 制造商:ROEBUCK 功能描述:FIRST AID GUIDE WORKPLACE 制造商:Dremel 功能描述:Shield Rotary Attachment Kit 制造商:DREMEL 功能描述:SHIELD ATTACHMENT KIT |
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