參數(shù)資料
型號: ACTS630HMSR
廠商: HARRIS SEMICONDUCTOR
元件分類: 通用總線功能
英文描述: Radiation Hardened EDAC (Error Detection and Correction)
中文描述: ACT SERIES, 16-BIT ERROR DETECT AND CORRECT CKT, UUC28
文件頁數(shù): 3/4頁
文件大?。?/td> 489K
代理商: ACTS630HMSR
3
ACTS630MS
Die Characteristics
DIE DIMENSIONS:
171 mils x 159 mils
6.7
μ
m x 6.3
μ
m
METALLIZATION:
Type: Al/Si/
Metal 1 Thickness: 7.125k
±
1.125k
Metal 2 Thickness: 9k
±
1k
GLASSIVATION:
Type: SiO
2
Thickness: 8k
±
1k
WORST CASE CURRENT DENSITY:
< 2.0 x 10
5
A/cm
2
BOND PAD SIZE:
110
μ
m x 110
μ
m
4.3 mils x 4.3 mils
Metallization Mask Layout
ACTS630MS
DEF
(1)
DB0
(2)
DB1
(3)
DB2
(4)
VCC SEF
(28)
S1
(26)
(15)
(14)
(13)
(12)
DB10DB11 GND DB12DB13DB14DB15
(16)
(17) (118)
DB3 (5)
DB4 (6)
DB5 (7)
DB6 (8)
DB7 (9)
DB8 (10)
DB9 (11)
(25) S0
(24) CB0
(23) CB1
(22) CB2
(21) CB3
(20) CB4
(19) CB5
(27)
Spec Number
518786
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