參數(shù)資料
型號(hào): AD5175BRMZ-10
廠商: Analog Devices Inc
文件頁(yè)數(shù): 13/20頁(yè)
文件大?。?/td> 0K
描述: IC DGTL POT 1024POS 10K 10MSOP
標(biāo)準(zhǔn)包裝: 50
接片: 1024
電阻(歐姆): 10k
電路數(shù): 1
溫度系數(shù): 標(biāo)準(zhǔn)值 35 ppm/°C
存儲(chǔ)器類型: 非易失
接口: I²C
電源電壓: 2.7 V ~ 5.5 V,±2.5 V ~ 2.75 V
工作溫度: -40°C ~ 125°C
安裝類型: 表面貼裝
封裝/外殼: 10-TFSOP,10-MSOP(0.118",3.00mm 寬)
供應(yīng)商設(shè)備封裝: 10-MSOP
包裝: 管件
AD5175
Rev. A | Page 20 of 20
OUTLINE DIMENSIONS
2.48
2.38
2.23
0.50
0.40
0.30
121009
-A
TOP VIEW
10
1
6
5
0.30
0.25
0.20
BOTTOM VIEW
PIN 1 INDEX
AREA
SEATING
PLANE
0.80
0.75
0.70
1.74
1.64
1.49
0.20 REF
0.05 MAX
0.02 NOM
0.50 BSC
EXPOSED
PAD
3.10
3.00 SQ
2.90
PIN 1
INDICATOR
(R 0.15)
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
Figure 31. 10-Lead Frame Chip Scale Package [LFCSP_WD]
3 mm × 3 mm Body, Very Thin, Dual Lead
(CP-10-9)
Dimensions shown in millimeters
COMPLIANT TO JEDEC STANDARDS MO-187-BA
091709-
A
0.70
0.55
0.40
5
10
1
6
0.50 BSC
0.30
0.15
1.10 MAX
3.10
3.00
2.90
COPLANARITY
0.10
0.23
0.13
3.10
3.00
2.90
5.15
4.90
4.65
PIN 1
IDENTIFIER
15° MAX
0.95
0.85
0.75
0.15
0.05
Figure 32. 10-Lead Mini Small Outline Package [MSOP]
(RM-10)
Dimensions shown in millimeters
ORDERING GUIDE
RAB (kΩ)
Resolution
Temperature Range
Package Description
Package Option
Branding
AD5175BRMZ-10
10
1,024
40°C to +125°C
10-Lead MSOP
RM-10
DDR
AD5175BRMZ-10-RL7
10
1,024
40°C to +125°C
10-Lead MSOP
RM-10
DDR
AD5175BCPZ-10-RL7
10
1,024
40°C to +125°C
10-Lead LFCSP_WD
CP-10-9
DEG
1 Z = RoHS Compliant Part.
I2C refers to a communications protocol originally developed by Philips Semiconductors (now NXP Semiconductors).
2010 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D08719-0-7/10(A)
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