參數(shù)資料
型號： AD5273EVAL
廠商： Analog Devices Inc
文件頁數(shù)： 12/24頁
文件大?。?/td> 0K
描述： BOARD EVAL FOR AD5273
標(biāo)準(zhǔn)包裝： 1
主要目的： 數(shù)字電位器
已用 IC / 零件： AD5273
已供物品： 板
相關(guān)產(chǎn)品： AD5273BRJZ10-R7DKR-ND - IC DGTL POT 64P 10K OTP SOT23-8
AD5273BRJZ50-REEL7TR-ND - IC POT DGTL 50K 64POS SOT23
AD5273BRJZ100-R7TR-ND - IC POT DGTL 1K 64POS SOT23
AD5273BRJZ1-REEL7TR-ND - IC POT DGTL 1K 64POS SOT23
AD5273BRJZ10-R7CT-ND - IC DGTL POT 64P 10K OTP SOT23-8
AD5273BRJZ10-R7TR-ND - IC DGTL POT 64P 10K OTP SOT23-8
AD5273BRJ10-R2CT-ND - IC DGTL POT 10K 64POS SOT23-8
AD5273BRJ1-R2CT-ND - IC DGTL POT 1K 64POS SOT23-8
AD5273BRJ100-R2CT-ND - IC DGTL POT 100K 64POS SOT23-8
AD5273BRJ50-R2CT-ND - IC DGTL POT 50K 64POS SOT23-8
AD5273
Rev. H | Page 2 of 24
TABLE OF CONTENTS
REVISION HISTORY
10/10—Rev. G to Rev. H
Changes to OTP Power Supply Parameter in Table 1.................. 4
Changes to VDD Pin Description in Table 3................................... 7
Changes to One-Time Programming Section ............................ 13
Changes to Power Supply Considerations Section, Figure 38 .. 15
Updated Outline Dimensions ....................................................... 22
Changes to Ordering Guide .......................................................... 22
8/08—Rev. F to Rev. G
Changes to Power Supplies Parameter in Table 1......................... 3
Updated Fuse Blow Condition to 400 ms Throughout ............... 5
1/08—Rev. E to Rev. F
Changes to Table 1............................................................................ 4
Changes to Table 2............................................................................ 6
Changes to Table 3............................................................................ 7
Inserted Figure 28........................................................................... 12
Changes to One-Time Programming Section ............................ 13
Changes to Power Supply Considerations Section..................... 15
Deleted Figure 35............................................................................ 15
Changes to Figure 36...................................................................... 15
Updated Outline Dimensions ....................................................... 22
Changes to Ordering Guide .......................................................... 22
1/05—Rev. D to Rev. E
Changes to Features ..........................................................................1
Changes to Specifications.................................................................3
Changes to Table 3.............................................................................6
Changes to Power Supply Considerations Section .................... 15
Changes to Figure 35 and Figure 37............................................. 15
Changes to DAC Section ............................................................... 19
Changes to Level Shift for Different Voltages
Operation Section........................................................................... 20
Deleted the Resistance Scaling Section ....................................... 20
Deleted the Resolution Enhancement Section ........................... 20
12/04—Rev. C to Rev. D
Updated Format..................................................................Universal
Changes to Specifications.................................................................3
Changes to Theory of Operation Section.................................... 13
Changes to Power Supply Consideration
s Section.................... 15
Changes to Figure 35, Figure 36, and Figure 37 ......................... 15
11/03—Rev. B to Rev. C
Changes to SDA Bit Definitions and Descriptions .................... 10
Changes to One-Time Programming (OTP) Section................ 11
Changes to Table III ....................................................................... 11
Changes to Power Supply Considerations .................................. 13
Changes to Figure 8, Figure 9, and Figure 10 ............................. 13
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